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MSP430G2230QDREP

Texas Instruments

MSP430G2230QDREP by Texas Instruments

MSP430G2230QDREP by Texas Instruments is a 16-bit microcontroller with 2048 ROM words, 128 RAM bytes, and 4-Ch 10-Bit ADC channels. Ideal for automotive applications, it operates at temperatures from -40 to 125 °C and offers low power mode with a max clock frequency of 16 MHz.

Median Price

$5.012

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 38,860 parts In-Stock

1+ parts

$3.285

100+ parts

$2.878

1k+ parts

$1.626

10k+ parts

-

38,860

$3.285

$2.878

$1.626

-

Mouser Electronics

USA . 2,498 parts In-Stock

1+ parts

$6.740

100+ parts

$4.060

1k+ parts

$2.910

10k+ parts

$2.780

2,498

$6.740

$4.060

$2.910

$2.780

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,831 parts In-Stock

1+ parts

$3.121

100+ parts

-

1k+ parts

-

10k+ parts

-

1,831

$3.121

-

-

-

Vyrian

USA . 8,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,400

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,939 parts In-Stock

1+ parts

$2.956

100+ parts

-

1k+ parts

-

10k+ parts

-

3,939

$2.956

-

-

-

Parana Technologies

USA . 288 parts In-Stock

1+ parts

$32.331

100+ parts

-

1k+ parts

$104.549

10k+ parts

-

288

$32.331

-

$104.549

-

DigiPath Technology Company

USA . 364 parts In-Stock

1+ parts

$35.600

100+ parts

-

1k+ parts

-

10k+ parts

-

364

$35.600

-

-

-

ChromeModa Solutions

Germany . 1,068 parts In-Stock

1+ parts

$36.327

100+ parts

$29.788

1k+ parts

-

10k+ parts

-

1,068

$36.327

$29.788

-

-

IDEA Electronic Components Group

UK . 9 parts In-Stock

1+ parts

$36.327

100+ parts

$34.511

1k+ parts

$32.694

10k+ parts

-

9

$36.327

$34.511

$32.694

-

A-Z Elektronik GmbH

Germany . 5,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,615

-

-

-

-

Overview

Discover the Texas Instruments MSP430G2230QDREP microcontroller, a cutting-edge solution for your electronic projects. With its high-quality manufacturing and wide range of applications in various industries, this versatile device offers unmatched value and benefits to customers. From its low power consumption to its superior performance, the MSP430G2230QDREP is designed to meet your needs and exceed your expectations. Take your projects to the next level with this innovative microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into electronic devices.

Maximum Supply Voltage: 3.6 V

Can operate at higher voltages which can provide more flexibility in power supply design.

On Chip Data RAM Width: 8

Having wider data RAM width allows for faster data processing and storage capabilities.

Bit Size: 16

16-bit architecture provides improved performance and processing capabilities compared to lower bit sizes.

No. of Timers: 2

Multiple timers allow for advanced timing functions and can enhance the device's capabilities for multitasking.

ADC Channels: YES

Analog to Digital Convertor channels enable the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfer between peripherals and memory without CPU intervention.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency, making it ideal for embedded control applications.

ROM Programmability: FLASH

Flash programmable memory provides flexibility for firmware updates and customization of the device's functionalities.

Technical Specifications

Microcontrollers MSP430G2230QDREP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

4

No. of Serial I/Os:

0

No. of Terminals:

8

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.75 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.39 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.91 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

DMA, TIMER, WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

MSP430G2230QDREP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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