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MSP430G2230QDEP

Texas Instruments

MSP430G2230QDEP by Texas Instruments

MSP430G2230QDEP by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, 4-Ch 10-Bit ADC channels, and 128B RAM. Ideal for automotive applications, it features I2C and SPI connectivity, low power mode, and peripherals like DMA and TIMER for efficient operation at up to 16MHz clock frequency.

Median Price

$5.646

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,255 parts In-Stock

1+ parts

$3.941

100+ parts

$3.453

1k+ parts

$1.951

10k+ parts

-

8,255

$3.941

$3.453

$1.951

-

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$7.350

100+ parts

$4.410

1k+ parts

$3.280

10k+ parts

$3.220

5

$7.350

$4.410

$3.280

$3.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,604 parts In-Stock

1+ parts

$3.744

100+ parts

-

1k+ parts

-

10k+ parts

-

2,604

$3.744

-

-

-

Vyrian

USA . 6,619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,619

-

-

-

-

Speed Components Ltd

Israel . 29 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,063 parts In-Stock

1+ parts

$3.350

100+ parts

-

1k+ parts

-

10k+ parts

-

4,063

$3.350

-

-

-

Corphita

USA . 2,799 parts In-Stock

1+ parts

$3.547

100+ parts

-

1k+ parts

-

10k+ parts

-

2,799

$3.547

-

-

-

Parana Technologies

USA . 1,021 parts In-Stock

1+ parts

$28.995

100+ parts

-

1k+ parts

$54.129

10k+ parts

-

1,021

$28.995

-

$54.129

-

DigiPath Technology Company

USA . 870 parts In-Stock

1+ parts

$31.927

100+ parts

-

1k+ parts

-

10k+ parts

-

870

$31.927

-

-

-

ChromeModa Solutions

Germany . 3,168 parts In-Stock

1+ parts

$32.579

100+ parts

$26.715

1k+ parts

-

10k+ parts

-

3,168

$32.579

$26.715

-

-

IDEA Electronic Components Group

UK . 650 parts In-Stock

1+ parts

$32.579

100+ parts

$30.950

1k+ parts

$29.321

10k+ parts

-

650

$32.579

$30.950

$29.321

-

Overview

Discover the MSP430G2230QDEP by Texas Instruments, a top-of-the-line microcontroller perfect for various applications. With its impeccable quality and innovative design, this device offers unmatched value to customers. Boasting low power consumption and high performance, this microcontroller is ideal for automotive use and other projects requiring precision and reliability. Take advantage of its advanced features, such as analog-to-digital converters and connectivity options like I2C and SPI, to streamline your designs and bring your ideas to life. Choose Texas Instruments for cutting-edge technology and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on printed circuit boards, saving space and ensuring reliable connections.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wider range of components.

Bit Size: 16

16-bit architecture enables efficient processing and handling of data, making the microcontroller suitable for a range of tasks including data manipulation and control operations.

No. of Timers: 2

Having multiple timers allows for precise timing control in applications such as scheduling tasks, generating pulses, or capturing events.

ADC Channels: YES

Analog to Digital Convertors enable the microcontroller to interface with analog sensors or signals, providing accurate and precise measurements for various applications.

ROM Programmability: FLASH

Flash programmable memory allows for easy and flexible reprogramming of code, enabling quick updates and modifications without the need for specialized equipment.

Connectivity: I2C, SPI

Support for common communication protocols like I2C and SPI enables easy integration with other devices, expanding the microcontroller's capabilities in interconnected systems.

Technical Specifications

Microcontrollers MSP430G2230QDEP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

4

No. of Serial I/Os:

0

No. of Terminals:

8

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.75 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.39 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.91 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

DMA, TIMER, WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

MSP430G2230QDEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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