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MSP430G2213IN20

Texas Instruments

MSP430G2213IN20 by Texas Instruments

MSP430G2213IN20 by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 256 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, SPI, UART, and more. With DMA channels and PWM support, it offers efficient data handling and control capabilities.

Median Price

$1.640

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,141 parts In-Stock

1+ parts

$1.774

100+ parts

$1.465

1k+ parts

$0.792

10k+ parts

-

2,141

$1.774

$1.465

$0.792

-

Mouser Electronics

USA . 397 parts In-Stock

1+ parts

$2.850

100+ parts

$1.740

1k+ parts

$1.610

10k+ parts

$1.550

397

$2.850

$1.740

$1.610

$1.550

Rochester

USA . 398 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.050

398

-

$1.240

$1.110

$1.050

DigiKey

USA . 398 parts In-Stock

1+ parts

-

100+ parts

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$1.640

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-

398

-

-

$1.640

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Verical

USA . 398 parts In-Stock

1+ parts

-

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-

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$1.387

10k+ parts

$1.313

398

-

-

$1.387

$1.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,733 parts In-Stock

1+ parts

$1.140

100+ parts

-

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2,733

$1.140

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-

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Nova Conductors

Japan . 46 parts In-Stock

1+ parts

$1.230

100+ parts

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46

$1.230

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Vyrian

USA . 3,599 parts In-Stock

1+ parts

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3,599

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DigiKey Marketplace

USA . 398 parts In-Stock

1+ parts

-

100+ parts

$1.140

1k+ parts

-

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398

-

$1.140

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 764 parts In-Stock

1+ parts

$0.970

100+ parts

-

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764

$0.970

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Semicontronic

India . 657 parts In-Stock

1+ parts

$0.970

100+ parts

$0.946

1k+ parts

$0.941

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657

$0.970

$0.946

$0.941

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Corphita

USA . 3,023 parts In-Stock

1+ parts

$1.080

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3,023

$1.080

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Continental Prestige Electronics

USA . 6,684 parts In-Stock

1+ parts

$1.230

100+ parts

-

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$1.205

6,684

$1.230

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-

$1.205

Argo Parts USA

USA . 2,155 parts In-Stock

1+ parts

$1.230

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-

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2,155

$1.230

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.230

100+ parts

$1.205

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100

$1.230

$1.205

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Corohmni

South Africa . 658 parts In-Stock

1+ parts

$1.230

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658

$1.230

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Microchip USA

USA . 2,558 parts In-Stock

1+ parts

$7.410

100+ parts

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2,558

$7.410

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Parana Technologies

USA . 289 parts In-Stock

1+ parts

$19.541

100+ parts

-

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$19.542

10k+ parts

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289

$19.541

-

$19.542

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DigiPath Technology Company

USA . 248 parts In-Stock

1+ parts

$21.517

100+ parts

$19.796

1k+ parts

-

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248

$21.517

$19.796

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ChromeModa Solutions

Germany . 2,713 parts In-Stock

1+ parts

$21.956

100+ parts

$18.004

1k+ parts

-

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2,713

$21.956

$18.004

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IDEA Electronic Components Group

UK . 18 parts In-Stock

1+ parts

$21.956

100+ parts

$20.858

1k+ parts

$19.760

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18

$21.956

$20.858

$19.760

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Perfect Parts

USA . 446 parts In-Stock

1+ parts

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446

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Overview

Unlock the power of innovation with the MSP430G2213IN20 by Texas Instruments. As a leading manufacturer in the field of microcontrollers, Texas Instruments delivers quality products that excel in a variety of applications. With advanced features like DMA channels and peripherals such as BOD and timers, this microcontroller offers unparalleled value to customers seeking high performance and reliability. Whether you're designing IoT devices or industrial automation systems, the MSP430G2213IN20 provides the versatility and efficiency needed to bring your ideas to life. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount capability facilitates easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V allows for flexibility in power input options.

On Chip Data RAM Width: 8

Wider on-chip data RAM width of 8 enhances data processing speed and efficiency.

Package Shape: RECTANGULAR

Rectangular package shape enables easy integration into existing electronic systems and PCB layouts.

Bit Size: 16

16-bit architecture provides improved processing capabilities and performance.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages (2V and 3.3V) offers compatibility with a wide range of electronic components and systems.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and peripheral integration.

Package Style (Meter): IN-LINE

The in-line package style ensures efficient use of space on the PCB and streamlined component layout.

Minimum Supply Voltage: 3.3 V

Support for a minimum supply voltage of 3.3V ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C makes the product suitable for industrial applications with demanding environmental conditions.

CPU Family: MSP430

Belonging to the MSP430 CPU family ensures compatibility with existing software and development tools for seamless integration.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for reliable operation even in extreme cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish with nickel/palladium/gold ensures reliable electrical connections and resistance to corrosion.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfer and processing without CPU intervention, improving overall system performance.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in PCB mounting options.

ROM Words: 2048

Large ROM capacity of 2048 words allows for extensive program storage and flexibility in application development.

Maximum Seated Height: 5.08 mm

Low maximum seated height of 5.08mm minimizes the overall profile of the device, making it suitable for space-constrained applications.

RAM Words: 0.25

Efficient RAM utilization with 0.25 words ensures optimal memory management and resource allocation.

Width: 7.62 mm

Compact width of 7.62mm allows for easy integration into tight spaces and small form factor designs.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes during manufacturing and maintenance.

Peripherals: "BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT

Rich set of peripherals including Brown-Out Detection (BOD), comparators, DMA, timers, and Watchdog Timer (WDT) enhance functionality and versatility.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16MHz enables fast data processing and real-time operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable soldering during assembly processes.

Length: 25.4 mm

Moderate length of 25.4mm provides a balance between compact size and functional capabilities.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions typically encountered in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing (RISC) architecture delivers efficient performance and power consumption for embedded applications.

No. of Timers: 2

Having 2 timers allows for precise timekeeping, scheduling, and event management within the application.

RAM Bytes: 256

Generous RAM capacity of 256 bytes facilitates efficient data storage and manipulation during program execution.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support and secure soldering connections during PCB assembly.

Maximum Supply Current: 0.42 mA

Low maximum supply current of 0.42mA contributes to energy efficiency and prolongs battery life in portable applications.

PWM Channels: YES

Pulse-Width Modulation (PWM) channels enable precise control of analog outputs for applications such as motor control and power regulation.

Connectivity: "I2C, IRDA, LIN, SPI, UART, USCI(2)

Diverse connectivity options including I2C, IRDA, LIN, SPI, UART, and USCI(2) support various communication protocols and interface standards.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible and easy reprogramming of the device for firmware updates and application customization.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54mm enables compatibility with common PCB layouts and connectors for easy integration.

Format: FIXED POINT

Fixed-point arithmetic format simplifies mathematical calculations and reduces computational overhead for optimized performance.

Speed: 16 rpm

Operating speed of 16 revolutions per minute (rpm) ensures efficient data processing and timely response to system events.

Low Power Mode: YES

Low power mode capability enhances energy efficiency and prolongs battery life in power-sensitive applications.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 enhances program storage capacity and execution speed for improved performance.

No. of I/O Lines: 16

16 I/O lines enable versatile interfacing with external peripherals and sensors for enhanced functionality and connectivity.

Technical Specifications

Microcontrollers MSP430G2213IN20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

25.4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

20

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT"

Trade Compliance

MSP430G2213IN20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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