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MSP430G2211IRSARQ1

Texas Instruments

MSP430G2211IRSARQ1 by Texas Instruments

MSP430G2211IRSARQ1 by Texas Instruments is an AEC-Q100 compliant microcontroller with CMOS technology. It features a peak reflow temperature of 260°C, 30s max time at peak reflow temp, and MSL of 2. Ideal for automotive applications requiring robust performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 9,406 parts In-Stock

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Digiode

USA . 945 parts In-Stock

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AZTECH Wire

Italy . 465 parts In-Stock

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$12.066

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One Stop Electronics

USA . 856 parts In-Stock

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$17.000

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Parana Technologies

USA . 1,577 parts In-Stock

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$31.048

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$71.597

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DigiPath Technology Company

USA . 1,510 parts In-Stock

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$34.187

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$31.452

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ChromeModa Solutions

Germany . 5,504 parts In-Stock

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$34.885

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$28.606

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IDEA Electronic Components Group

UK . 385 parts In-Stock

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$34.885

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$33.141

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$31.396

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QUARKTWIN TECHNOLOGY LTD

USA . 14,904 parts In-Stock

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Corphita

USA . 4,032 parts In-Stock

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Microchip USA

USA . 3,343 parts In-Stock

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Overview

Unlock the power of innovation with the MSP430G2211IRSARQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers like the MSP430G2211IRSARQ1 designed to meet the highest standards. Ideal for various applications, this microcontroller offers unparalleled value and benefits to customers seeking reliable performance and efficiency. Experience the advantages of Texas Instruments technology and elevate your projects to new heights with the MSP430G2211IRSARQ1.

Feature Benefit Bullets

Screening Level: AEC-Q100

This product has passed stringent automotive requirements, ensuring high reliability and durability.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent corrosion resistance and ensures a reliable electrical connection.

Maximum Time At Peak Reflow Temperature (s): 30

With a quick reflow process, manufacturing efficiency is improved and the risk of component damage is reduced.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable solder joints and ensures the product can withstand harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture offers high performance and low power consumption, making this microcontroller suitable for a wide range of applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, increasing the efficiency of the product.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates that the product can withstand a moderate level of moisture exposure, making it suitable for various environments.

Technical Specifications

Microcontrollers MSP430G2211IRSARQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

MSP430G2211IRSARQ1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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