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MSP430G2203IPW28

Texas Instruments

MSP430G2203IPW28 by Texas Instruments

MSP430G2203IPW28 by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 256 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SPI(2), UART, USCI(2).

Median Price

$1.679

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,950 parts In-Stock

1+ parts

$1.398

100+ parts

$1.154

1k+ parts

$0.624

10k+ parts

-

14,950

$1.398

$1.154

$0.624

-

DigiKey

USA . 282 parts In-Stock

1+ parts

$1.960

100+ parts

$1.174

1k+ parts

$1.106

10k+ parts

-

282

$1.960

$1.174

$1.106

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,972 parts In-Stock

1+ parts

$1.328

100+ parts

-

1k+ parts

-

10k+ parts

-

4,972

$1.328

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-

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Vyrian

USA . 4,109 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,109

-

-

-

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ACDS - Activité Composants Distribution Service

France . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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150

-

-

-

-

Bristol Electronics

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$1.274

1k+ parts

$0.764

10k+ parts

-

150

-

$1.274

$0.764

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Dan-Mar Components

USA . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,587 parts In-Stock

1+ parts

$1.190

100+ parts

-

1k+ parts

-

10k+ parts

-

7,587

$1.190

-

-

-

Corphita

USA . 4,973 parts In-Stock

1+ parts

$1.258

100+ parts

-

1k+ parts

-

10k+ parts

-

4,973

$1.258

-

-

-

Microchip USA

USA . 2,177 parts In-Stock

1+ parts

$12.090

100+ parts

$12.020

1k+ parts

$11.980

10k+ parts

$11.940

2,177

$12.090

$12.020

$11.980

$11.940

Parana Technologies

USA . 822 parts In-Stock

1+ parts

$58.591

100+ parts

-

1k+ parts

-

10k+ parts

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822

$58.591

-

-

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DigiPath Technology Company

USA . 514 parts In-Stock

1+ parts

$64.516

100+ parts

$59.355

1k+ parts

-

10k+ parts

-

514

$64.516

$59.355

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ChromeModa Solutions

Germany . 2,921 parts In-Stock

1+ parts

$65.833

100+ parts

$53.983

1k+ parts

-

10k+ parts

-

2,921

$65.833

$53.983

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IDEA Electronic Components Group

UK . 1,095 parts In-Stock

1+ parts

$65.833

100+ parts

$62.541

1k+ parts

$59.250

10k+ parts

-

1,095

$65.833

$62.541

$59.250

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Overview

Discover the innovative MSP430G2203IPW28 microcontroller by Texas Instruments, a versatile solution for a wide range of applications. With a reputation for superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package, perfect for industrial-grade projects. Offering low power consumption and high performance, this microcontroller boasts advanced features like PWM channels and multiple connectivity options. Experience seamless integration and enhanced functionality with the MSP430G2203IPW28, setting new standards in efficiency and productivity for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltage, providing flexibility in various applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, suitable for a wide range of environments.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the device, enabling updates and customization.

Connectivity: "I2C, IRDA, SPI(2), UART, USCI(2)

Multiple connectivity options provide versatility in communication interfaces for different applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture with integrated peripherals enhances processing speed and efficiency.

Maximum Clock Frequency: 0.032 MHz

High clock frequency allows for faster data processing.

Low Power Mode: YES

Low power mode helps conserve energy, making the product suitable for battery-operated devices.

Technical Specifications

Microcontrollers MSP430G2203IPW28 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

24

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, TIMER(6), WDT"

Trade Compliance

MSP430G2203IPW28 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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