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MSP430G2201IPW4Q1

Texas Instruments

MSP430G2201IPW4Q1 by Texas Instruments

MSP430G2201IPW4Q1 by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 128 RAM bytes. Operating at a max clock frequency of 0.05 MHz, it is ideal for industrial applications requiring low power consumption and PWM channels for control systems. With a temperature range from -40 to 85 °C, this CMOS technology-based MCU offers dual terminal position in a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,651 parts In-Stock

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Digiode

USA . 626 parts In-Stock

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626

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Distributors (Availability)

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AZTECH Wire

Italy . 665 parts In-Stock

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$18.429

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One Stop Electronics

USA . 1,441 parts In-Stock

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$20.000

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Parana Technologies

USA . 821 parts In-Stock

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$64.117

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821

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DigiPath Technology Company

USA . 716 parts In-Stock

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$70.601

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$64.953

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716

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$64.953

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ChromeModa Solutions

Germany . 4,796 parts In-Stock

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$72.042

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$59.074

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$59.074

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IDEA Electronic Components Group

UK . 1,181 parts In-Stock

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$72.042

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$68.440

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$64.838

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Corphita

USA . 599 parts In-Stock

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Microchip USA

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Overview

Unlock unparalleled performance and efficiency with the MSP430G2201IPW4Q1 by Texas Instruments, a leading name in the industry. This microcontroller is designed for a wide range of applications, offering customers exceptional value and benefits. With its cutting-edge technology and top-notch quality, this product ensures reliability and precision in every use. Experience seamless operation and enhanced capabilities with the MSP430G2201IPW4Q1, setting new standards in the field of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microcontroller lightweight and durable, allowing for easy handling and long-lasting performance.

Surface Mount: YES

Being surface mountable, this microcontroller can be easily integrated onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can operate efficiently within common voltage supply ranges, making it versatile for various applications.

Screening Level: AEC-Q100

Having AEC-Q100 screening level ensures that the microcontroller meets automotive-grade quality and reliability standards, making it suitable for automotive applications.

Bit Size: 16

The 16-bit size of this microcontroller allows for higher data processing capabilities, making it ideal for handling more complex tasks and computations.

Power Supplies (V): 2/3.3

Supporting power supplies of 2V and 3.3V provides flexibility in voltage requirements, catering to a wider range of power sources and applications.

No. of Terminals: 14

With 14 terminals, this microcontroller offers sufficient connectivity options for interfacing with external components and peripherals, enhancing its versatility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style of this microcontroller enables compact and space-saving designs, making it suitable for applications with limited space constraints.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions, expanding the range of applications where this microcontroller can be used.

CPU Family: MSP430

Being part of the MSP430 CPU family indicates that this microcontroller offers low power consumption, high efficiency, and a wide range of peripherals for enhanced functionality.

Technical Specifications

Microcontrollers MSP430G2201IPW4Q1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

10

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

2048

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

MSP430G2201IPW4Q1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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