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MSP430G2132IRSA16T

Texas Instruments

MSP430G2132IRSA16T by Texas Instruments

MSP430G2132IRSA16T by Texas Instruments is a 16-bit microcontroller with 1024 ROM words and 128 RAM bytes. It features 8 ADC channels, 10-bit resolution, and operates at a max clock frequency of 0.032 MHz. Ideal for industrial applications requiring low power consumption and connectivity via I2C, SPI, and USI interfaces.

Median Price

$1.060

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 270 parts In-Stock

1+ parts

$0.600

100+ parts

$0.600

1k+ parts

$0.600

10k+ parts

$0.600

270

$0.600

$0.600

$0.600

$0.600

Farnell

UK . 270 parts In-Stock

1+ parts

$0.621

100+ parts

$0.478

1k+ parts

$0.450

10k+ parts

$0.436

270

$0.621

$0.478

$0.450

$0.436

Texas Instruments

USA . 2,000 parts In-Stock

1+ parts

$1.194

100+ parts

$0.986

1k+ parts

$0.533

10k+ parts

-

2,000

$1.194

$0.986

$0.533

-

DigiKey

USA . 710 parts In-Stock

1+ parts

$1.930

100+ parts

$1.149

1k+ parts

-

10k+ parts

-

710

$1.930

$1.149

-

-

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$1.040

1k+ parts

$0.863

10k+ parts

$0.770

500

-

$1.040

$0.863

$0.770

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.079

10k+ parts

$0.962

500

-

-

$1.079

$0.962

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,596 parts In-Stock

1+ parts

$0.703

100+ parts

-

1k+ parts

-

10k+ parts

-

2,596

$0.703

-

-

-

Vyrian

USA . 3,501 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,501

-

-

-

-

DigiKey Marketplace

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.770

1k+ parts

-

10k+ parts

-

500

-

$0.770

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 1,534 parts In-Stock

1+ parts

$0.580

100+ parts

$0.580

1k+ parts

$0.920

10k+ parts

-

1,534

$0.580

$0.580

$0.920

-

Corphita

USA . 2,808 parts In-Stock

1+ parts

$0.666

100+ parts

-

1k+ parts

-

10k+ parts

-

2,808

$0.666

-

-

-

Parana Technologies

USA . 1,910 parts In-Stock

1+ parts

$58.981

100+ parts

-

1k+ parts

-

10k+ parts

-

1,910

$58.981

-

-

-

DigiPath Technology Company

USA . 121 parts In-Stock

1+ parts

$64.946

100+ parts

$59.750

1k+ parts

-

10k+ parts

-

121

$64.946

$59.750

-

-

IDEA Electronic Components Group

UK . 1,669 parts In-Stock

1+ parts

$66.271

100+ parts

$62.957

1k+ parts

$59.644

10k+ parts

-

1,669

$66.271

$62.957

$59.644

-

ChromeModa Solutions

Germany . 1,045 parts In-Stock

1+ parts

$66.271

100+ parts

$54.342

1k+ parts

-

10k+ parts

-

1,045

$66.271

$54.342

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 11,337 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,337

-

-

-

-

Microchip USA

USA . 9,579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,579

-

-

-

-

Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

560

-

-

-

-

Overview

Unlock endless possibilities with the MSP430G2132IRSA16T microcontroller by Texas Instruments. Designed with precision and innovation, this powerful chip delivers reliable performance for a wide range of applications. From smart home devices to industrial automation, this microcontroller offers unmatched value and efficiency. Experience seamless connectivity, low power consumption, and advanced features that will elevate your projects to new heights. Trust in Texas Instruments for quality you can depend on. Elevate your designs with the MSP430G2132IRSA16T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Makes the product durable and resistant to damage.

Surface Mount: YES

Enables easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options.

On Chip Data RAM Width: 8

Provides ample on-chip memory for efficient data processing.

Bit Size: 16

Offers high processing capabilities for complex operations.

Power Supplies (V): 2/3.3

Allows for flexible power input options.

No. of Terminals: 16

Provides multiple connection points for peripherals.

Package Style (Meter): CHIP CARRIER

Ensures compact packaging and easy integration into electronic devices.

Minimum Supply Voltage: 1.8 V

Enables efficient operation even at low power supply levels.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with high operating temperatures.

CPU Family: MSP430

Reliable and well-established microcontroller family.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides good conductivity and corrosion resistance for terminals.

ADC Channels: YES

Allows for analog to digital conversion, essential for sensor interfacing.

DMA Channels: YES

Facilitates efficient data transfer between peripherals and memory.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for optimized performance and power efficiency.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for optimized performance and power efficiency.

Maximum Clock Frequency: 0.032 MHz

Provides high-speed processing capabilities for real-time applications.

ROM Programmability: FLASH

Allows for easy reprogramming of the ROM for firmware updates.

Connectivity: I2C, SPI, USI

Supports multiple communication protocols for versatile connectivity.

No. of I/O Lines: 10

Offers ample input/output options for interfacing with external devices.

Technical Specifications

Microcontrollers MSP430G2132IRSA16T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, DMA(1), TIMER(4), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2132IRSA16T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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