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MSP430G2121IRSAQ1

Texas Instruments

MSP430G2121IRSAQ1 by Texas Instruments

MSP430G2121IRSAQ1 by Texas Instruments is a 16-bit microcontroller with 128B RAM, 1024 ROM words, and 16MHz clock frequency. Ideal for industrial applications, it features ADC and DMA channels, operates at -40 to 85°C, and consumes 0.37mA supply current.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,007 parts In-Stock

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Digiode

USA . 1,461 parts In-Stock

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One Stop Electronics

USA . 793 parts In-Stock

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$2.000

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AZTECH Wire

Italy . 614 parts In-Stock

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$7.136

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Ampacity Inc.

Singapore . 1,129 parts In-Stock

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$20.000

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Parana Technologies

USA . 1,010 parts In-Stock

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$45.849

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DigiPath Technology Company

USA . 1,311 parts In-Stock

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$50.486

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ChromeModa Solutions

Germany . 3,978 parts In-Stock

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$51.516

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$42.243

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IDEA Electronic Components Group

UK . 1,741 parts In-Stock

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$51.516

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$48.940

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$46.364

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Microchip USA

USA . 4,007 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,503 parts In-Stock

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Corphita

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Overview

Unlock endless possibilities with the Texas Instruments MSP430G2121IRSAQ1 microcontroller. Designed with precision and performance in mind, this chip offers unparalleled reliability for a wide range of applications. From automotive to industrial, this versatile microcontroller delivers seamless integration and efficient operation. Experience the power of cutting-edge technology with Texas Instruments, where innovation meets quality. Elevate your projects with the MSP430G2121IRSAQ1 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Surface mount capability allows for easy and compact integration into circuit boards, helping to save space and streamline design.

Package Shape: SQUARE

The square package shape ensures a uniform and consistent form factor, making it easier to integrate into various designs and layouts.

Bit Size: 16

With a 16-bit size, the microcontroller can process data and instructions with higher precision and accuracy, making it suitable for applications that require higher computational capabilities.

Power Supplies (V): 2/3.3

The availability of multiple power supply options allows for flexibility in power management and compatibility with different power sources, enhancing the versatility of the product.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz enables fast operation and response times, making the microcontroller suitable for applications that require real-time processing and high-speed data handling.

RAM Bytes: 128

With 128 bytes of RAM, the microcontroller can efficiently store and access data during operation, enhancing its overall performance and multitasking capabilities.

Technology: CMOS

The CMOS technology used in the microcontroller ensures low power consumption, high noise immunity, and reliable operation, making it an energy-efficient and reliable choice for various applications.

Technical Specifications

Microcontrollers MSP430G2121IRSAQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N16

Length:

4 mm

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

1024

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

MSP430G2121IRSAQ1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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