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MSP430G2121IRSA16T

Texas Instruments

MSP430G2121IRSA16T by Texas Instruments

MSP430G2121IRSA16T by Texas Instruments is a 16-bit microcontroller with 1024 ROM words and 128 RAM bytes. Operating at up to 0.032 MHz, it features BOR, TIMER(2), WDT peripherals for industrial applications. With I2C, SPI, USI connectivity and low power mode, it's ideal for IoT devices requiring high efficiency.

Median Price

$1.072

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,500 parts In-Stock

1+ parts

$1.317

100+ parts

$1.013

1k+ parts

$0.533

10k+ parts

-

4,500

$1.317

$1.013

$0.533

-

Rochester

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

$0.937

1k+ parts

$0.778

10k+ parts

$0.694

2,400

-

$0.937

$0.778

$0.694

DigiKey

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.170

10k+ parts

-

2,400

-

-

$1.170

-

Verical

USA . 1,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.973

10k+ parts

$0.867

1,650

-

-

$0.973

$0.867

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,133 parts In-Stock

1+ parts

$0.703

100+ parts

-

1k+ parts

-

10k+ parts

-

3,133

$0.703

-

-

-

Vyrian

USA . 5,131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,131

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,286 parts In-Stock

1+ parts

$0.666

100+ parts

-

1k+ parts

-

10k+ parts

-

4,286

$0.666

-

-

-

Microchip USA

USA . 171 parts In-Stock

1+ parts

$7.260

100+ parts

$7.240

1k+ parts

$7.240

10k+ parts

$7.220

171

$7.260

$7.240

$7.240

$7.220

Parana Technologies

USA . 2,160 parts In-Stock

1+ parts

$13.774

100+ parts

-

1k+ parts

$14.260

10k+ parts

-

2,160

$13.774

-

$14.260

-

ChromeModa Solutions

Germany . 5,471 parts In-Stock

1+ parts

$15.476

100+ parts

$12.690

1k+ parts

-

10k+ parts

-

5,471

$15.476

$12.690

-

-

IDEA Electronic Components Group

UK . 610 parts In-Stock

1+ parts

$15.476

100+ parts

$14.702

1k+ parts

$13.928

10k+ parts

-

610

$15.476

$14.702

$13.928

-

DigiPath Technology Company

USA . 2,062 parts In-Stock

1+ parts

-

100+ parts

$13.953

1k+ parts

-

10k+ parts

-

2,062

-

$13.953

-

-

Perfect Parts

USA . 840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

840

-

-

-

-

Overview

Unlock the potential of your next project with the MSP430G2121IRSA16T microcontroller by Texas Instruments. Renowned for their quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this microcontroller offers low power consumption, high performance, and versatile connectivity options. Whether you're designing a smart home device or a wearable gadget, the MSP430G2121IRSA16T provides the value, efficiency, and functionality you need to bring your ideas to life. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the microcontroller suitable for a variety of applications.

Surface Mount: YES

Easy to integrate onto PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources.

Bit Size: 16

Provides sufficient processing power for various tasks.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher temperatures may be encountered.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient processing and control of peripherals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Connectivity: I2C, SPI, USI

Supports multiple communication protocols for enhanced connectivity options.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller's firmware.

Low Power Mode: YES

Enables power-efficient operation, ideal for battery-powered devices.

Technical Specifications

Microcontrollers MSP430G2121IRSA16T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOR, TIMER(2), WDT"

Trade Compliance

MSP430G2121IRSA16T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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