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MSP430G2112IPW14

Texas Instruments

MSP430G2112IPW14 by Texas Instruments

MSP430G2112IPW14 by Texas Instruments is a 16-bit microcontroller with 1024 ROM words, 128 RAM bytes, and 16 MHz clock frequency. Ideal for industrial applications, it features I2C, SPI, USI connectivity and low power mode for efficient operation in a compact form factor.

Median Price

$1.494

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,730 parts In-Stock

1+ parts

$1.494

100+ parts

$1.150

1k+ parts

$0.605

10k+ parts

-

10,730

$1.494

$1.150

$0.605

-

DigiKey

USA . 990 parts In-Stock

1+ parts

$1.910

100+ parts

$1.148

1k+ parts

$1.030

10k+ parts

-

990

$1.910

$1.148

$1.030

-

Rochester

USA . 70 parts In-Stock

1+ parts

-

100+ parts

$1.180

1k+ parts

$0.979

10k+ parts

$0.873

70

-

$1.180

$0.979

$0.873

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 130 parts In-Stock

1+ parts

$0.798

100+ parts

-

1k+ parts

-

10k+ parts

-

130

$0.798

-

-

-

Vyrian

USA . 3,545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,545

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,721 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

-

10k+ parts

-

3,721

$0.710

-

-

-

Corphita

USA . 366 parts In-Stock

1+ parts

$0.756

100+ parts

-

1k+ parts

-

10k+ parts

-

366

$0.756

-

-

-

Microchip USA

USA . 1,244 parts In-Stock

1+ parts

$11.700

100+ parts

$11.630

1k+ parts

$11.590

10k+ parts

$11.560

1,244

$11.700

$11.630

$11.590

$11.560

Parana Technologies

USA . 1,424 parts In-Stock

1+ parts

$71.580

100+ parts

-

1k+ parts

-

10k+ parts

-

1,424

$71.580

-

-

-

ChromeModa Solutions

Germany . 1,946 parts In-Stock

1+ parts

$80.427

100+ parts

$65.950

1k+ parts

-

10k+ parts

-

1,946

$80.427

$65.950

-

-

IDEA Electronic Components Group

UK . 807 parts In-Stock

1+ parts

$80.427

100+ parts

$76.406

1k+ parts

$72.384

10k+ parts

-

807

$80.427

$76.406

$72.384

-

QUARKTWIN TECHNOLOGY LTD

USA . 8,101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,101

-

-

-

-

DigiPath Technology Company

USA . 1,512 parts In-Stock

1+ parts

-

100+ parts

$72.513

1k+ parts

-

10k+ parts

-

1,512

-

$72.513

-

-

Overview

Unlock the endless possibilities with the Texas Instruments MSP430G2112IPW14 microcontroller. Designed with precision and expertise, this powerful device offers unparalleled performance in a compact package. Perfect for a wide range of applications, from IoT devices to industrial automation, this microcontroller delivers reliability and efficiency like no other. Experience seamless connectivity with I2C, SPI, and USI interfaces, while enjoying low power modes for extended battery life. Trust in Texas Instruments to bring you quality and innovation, making your projects smarter and more efficient than ever before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, making it compatible with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to integrate the microcontroller into various designs and layouts.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it a reliable choice for power-efficient applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC architecture, this product offers efficient data processing and control capabilities, suitable for a wide range of embedded systems.

Technology: CMOS

The CMOS technology used in this microcontroller ensures low power consumption and high noise immunity, making it ideal for battery-powered devices and sensitive applications.

Maximum Clock Frequency: 16 MHz

With a high maximum clock frequency, this microcontroller can handle complex tasks and process data quickly, making it suitable for applications that require fast performance.

Connectivity: "I2C, SPI, USI

Support for I2C, SPI, and USI communication protocols enables seamless interfacing with other devices, expanding the connectivity options of the microcontroller.

No. of I/O Lines: 16

Having 16 I/O lines provides ample input and output options for connecting peripherals and sensors, enhancing the versatility and functionality of the microcontroller.

Technical Specifications

Microcontrollers MSP430G2112IPW14 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, COMPARATOR(8), TIMER(4), WDT"

Trade Compliance

MSP430G2112IPW14 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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