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MSP430G2101IRSAQ1

Texas Instruments

MSP430G2101IRSAQ1 by Texas Instruments

MSP430G2101IRSAQ1 by Texas Instruments is a 16-bit microcontroller with 128 bytes of RAM and 1024 ROM words. Operating at a max clock frequency of 0.05 MHz, it has 10 I/O lines and PWM channels for various industrial applications. With a supply voltage range of 2-3.3 V, this CMOS technology-based chip carrier is suitable for low-power embedded systems in automotive electronics due to its AEC-Q100 screening level.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,673 parts In-Stock

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Digiode

USA . 2,148 parts In-Stock

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One Stop Electronics

USA . 618 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 559 parts In-Stock

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$15.743

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Ampacity Inc.

Singapore . 224 parts In-Stock

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$16.000

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Parana Technologies

USA . 1,859 parts In-Stock

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DigiPath Technology Company

USA . 1,504 parts In-Stock

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$41.021

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$37.739

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ChromeModa Solutions

Germany . 3,522 parts In-Stock

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$41.858

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$34.324

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IDEA Electronic Components Group

UK . 352 parts In-Stock

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$41.858

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$37.672

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Microchip USA

USA . 2,006 parts In-Stock

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Corphita

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Overview

Unleash the power of innovation with the Texas Instruments MSP430G2101IRSAQ1 microcontroller. Designed with precision and reliability in mind, this versatile device offers unmatched performance for a wide range of applications. From automotive to industrial automation, the MSP430G2101IRSAQ1 delivers exceptional value, efficiency, and flexibility, making it the perfect choice for your next project. Trust in Texas Instruments' legacy of quality and expertise to take your designs to the next level. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power requirements and compatibility with a variety of systems.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high quality and reliability, making the microcontroller suitable for automotive applications.

Bit Size: 16

16-bit architecture provides enhanced performance and processing capabilities for complex tasks and applications.

Power Supplies (V): 2/3.3

Support for multiple power supply options allows for versatile usage in different voltage environments.

No. of Terminals: 16

16 terminals provide ample connectivity options for interfacing with external devices and systems.

Minimum Supply Voltage: 3.3 V

Low minimum supply voltage ensures efficient power consumption and operation in energy-sensitive applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range makes the microcontroller suitable for industrial environments with varying temperature conditions.

CPU Family: MSP430

MSP430 CPU family is known for low power consumption and high performance, making it a reliable choice for battery-powered applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range ensures reliable operation even in harsh cold environments.

ROM Words: 1024

1024 ROM words provide ample storage capacity for program instructions and data, allowing for versatile application development.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient processing and execution of instructions, suitable for real-time applications.

RAM Bytes: 128

128 bytes of RAM provide temporary storage for data manipulation and processing, enhancing the microcontroller's computational capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to program code, facilitating software development and debugging.

Technical Specifications

Microcontrollers MSP430G2101IRSAQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES MINIMUM SUPPLY 1.8 V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N16

Length:

4 mm

No. of I/O Lines:

10

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

1024

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

MSP430G2101IRSAQ1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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