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MSP430FR6989IPN

Texas Instruments

MSP430FR6989IPN by Texas Instruments

MSP430FR6989IPN by Texas Instruments is a 16-bit microcontroller with a max clock frequency of 24 MHz. It features 131072 ROM words, 2048 RAM bytes, and 12-ch 12-bit ADC channels. This microcontroller is commonly used in industrial applications requiring low power consumption and connectivity options such as I2C, IRDA, SPI, UART, and USCI.

Median Price

$10.197

Lifecycle Status

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6

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1k+

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Texas Instruments

USA . 1,476 parts In-Stock

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$9.194

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$7.496

1k+ parts

$4.997

10k+ parts

-

1,476

$9.194

$7.496

$4.997

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DigiKey

USA . 217 parts In-Stock

1+ parts

$11.200

100+ parts

$8.164

1k+ parts

$6.840

10k+ parts

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217

$11.200

$8.164

$6.840

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Digiode

USA . 2,127 parts In-Stock

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$8.734

100+ parts

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2,127

$8.734

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Nova Conductors

Japan . 59 parts In-Stock

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$9.290

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59

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Semtec, LLC

USA . 2,016 parts In-Stock

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Vyrian

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533

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Ampacity Inc.

Singapore . 822 parts In-Stock

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$7.810

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822

$7.810

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Semicontronic

India . 445 parts In-Stock

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$7.810

100+ parts

$7.615

1k+ parts

$7.576

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445

$7.810

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$7.576

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Corphita

USA . 4,113 parts In-Stock

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$8.275

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4,113

$8.275

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Continental Prestige Electronics

USA . 6,741 parts In-Stock

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$9.290

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$9.104

6,741

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$9.104

Netroflash

USA . 100 parts In-Stock

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$9.290

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100

$9.290

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$9.476

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$9.476

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$9.476

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200

$9.476

$9.476

$9.476

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Component Stockers USA

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$11.730

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Corohmni

South Africa . 734 parts In-Stock

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Parana Technologies

USA . 1,481 parts In-Stock

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$32.948

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$116.185

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1,481

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$116.185

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Microchip USA

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$33.630

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$33.150

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$32.910

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$32.670

2,723

$33.630

$33.150

$32.910

$32.670

DigiPath Technology Company

USA . 2,352 parts In-Stock

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$36.280

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$33.377

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2,352

$36.280

$33.377

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ChromeModa Solutions

Germany . 6,105 parts In-Stock

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$37.020

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$30.356

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6,105

$37.020

$30.356

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IDEA Electronic Components Group

UK . 1,072 parts In-Stock

1+ parts

$37.020

100+ parts

$35.169

1k+ parts

$33.318

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1,072

$37.020

$35.169

$33.318

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Argo Parts USA

USA . 3,853 parts In-Stock

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3,853

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Overview

Experience the power of innovation with the MSP430FR6989IPN microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers unparalleled quality and reliability in their products. The MSP430FR6989IPN is a versatile microcontroller that is perfect for a wide range of applications. With its low power mode and high clock frequency, this microcontroller offers exceptional performance while conserving energy. Equipped with advanced peripherals such as BOD, Comparator, CRC, DMA, RTC, Timer, and WDT, it provides endless possibilities for customization. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, the MSP430FR6989IPN will exceed your expectations with its precision and efficiency. Discover the future of microcontrollers today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort in assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can handle a wide range of power inputs, increasing its versatility and compatibility.

On Chip Data RAM Width: 8

The 8-bit on-chip data RAM width enables efficient data processing, allowing for faster execution of instructions and improving overall performance.

Package Shape: SQUARE

The square package shape allows for compact and efficient placement on circuit boards, optimizing space utilization in electronic devices.

Bit Size: 16

The 16-bit bit size enhances the microcontroller's computational capabilities, enabling it to handle complex operations and calculations with ease.

No. of Terminals: 80

With 80 terminals, this microcontroller offers extensive connectivity options, providing flexibility for various input and output configurations.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures efficient heat dissipation and reliable electrical connections, making it ideal for space-constrained applications.

Minimum Supply Voltage: 1.8 V

The minimum supply voltage requirement of 1.8 V allows for lower power consumption, extending battery life and reducing overall energy consumption.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85°C allows the microcontroller to withstand high-temperature environments, ensuring reliable and stable operation in demanding conditions.

CPU Family: MSP430

Being part of the MSP430 CPU family, this microcontroller benefits from a proven and robust architecture, ensuring reliable and efficient performance in a wide range of applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can function reliably even in extremely cold environments, making it suitable for various industries and climates.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold for terminal finish enhances the microcontroller's durability and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

The availability of ADC channels allows the microcontroller to convert analog signals into digital data, enabling precise measurement and control in applications such as sensor interfacing and data acquisition.

DMA Channels: YES

With DMA channels, the microcontroller can offload data transfer tasks, freeing up the CPU for other critical operations, resulting in improved overall system performance.

Terminal Position: QUAD

The quad terminal position offers increased stability and secure connections, minimizing the risk of accidental disconnection and ensuring reliable signal transmission.

ROM Words: 131072

With a ROM capacity of 131072 words, this microcontroller offers ample storage for program code, allowing for complex and feature-rich applications.

Maximum Seated Height: 1.6 mm

The microcontroller's maximum seated height of 1.6 mm allows for a compact profile in device designs, enabling the creation of sleek and slim electronic products.

RAM Words: 2

The microcontroller's RAM capacity of 2 words provides temporary storage for data during program execution, facilitating efficient and seamless operation.

Width: 12 mm

With a width of 12 mm, this microcontroller's compact form factor allows for easy integration into various electronic devices without sacrificing functionality.

Boundary Scan: YES

The presence of boundary scan capability simplifies the testing and debugging of the microcontroller during development, ensuring faster and more efficient product development cycles.

Peripherals: BOD, COMPARATOR(16), CRC, DMA(3), RTC, TIMER(20), WDT

The microcontroller's extensive range of peripherals, including a built-in BOD, multiple comparators, CRC, DMA, RTC, timers, and a watchdog timer, enhances its functionality and enables it to handle a wide range of tasks in diverse applications.

Maximum Clock Frequency: 24 MHz

With a maximum clock frequency of 24 MHz, this microcontroller can execute instructions at high speed, allowing for swift and responsive system operation.

Peak Reflow Temperature °C: 260

The microcontroller's peak reflow temperature of 260°C ensures reliable solder joints during the manufacturing process, guaranteeing robust and durable product assembly.

Length: 12 mm

The microcontroller's length of 12 mm contributes to its compact size, making it suitable for space-constrained designs and applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microcontroller withstands harsh operating conditions, ensuring resilience and long-term reliability in rugged environments.

Peripheral IC Type: MICROCONTROLLER, RISC

With a microcontroller RISC architecture, this integrated circuit offers optimized processing power, energy efficiency, and ease of programming, making it an ideal choice for a wide range of applications.

No. of Timers: 20

The availability of 20 timers provides precise timing and scheduling capabilities, facilitating various time-related functions, such as event management, PWM generation, and synchronization.

RAM Bytes: 2048

Featuring a RAM capacity of 2048 bytes, this microcontroller supplies ample storage for data manipulation, enabling efficient data handling and computation.

Technology: CMOS

Built using CMOS technology, this microcontroller offers low power consumption, high noise immunity, and increased reliability, making it suitable for battery-powered and noise-sensitive applications.

Terminal Form: GULL WING

The gull-wing terminal form ensures secure connections and ease of soldering, simplifying the manufacturing and installation process, and ensuring reliable electrical connections.

Analog To Digital Convertors: 12-Ch 12-Bit

The 12-channel 12-bit analog-to-digital converters allow the microcontroller to accurately measure and process analog signals, enabling precise and high-resolution data acquisition.

Maximum Supply Current: 1.62 mA

With a maximum supply current of 1.62 mA, this microcontroller operates efficiently within strict power consumption constraints, making it suitable for battery-powered devices and energy-efficient applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V provides a stable power source for the microcontroller, ensuring consistent and reliable operation under normal operating conditions.

No. of DMA Channels: 3

The presence of 3 DMA channels allows for efficient and rapid data transfer between peripherals, reducing CPU overhead and enhancing overall system performance.

No. of Serial I/Os: 3

With 3 serial I/Os, this microcontroller facilitates communication with external devices, enabling data exchange and integration with a wide range of peripherals.

PWM Channels: YES

The availability of PWM channels allows the microcontroller to generate accurate and adjustable analog output signals, enabling precise control of motors, LEDs, and other analog devices.

Connectivity: I2C, IRDA, SPI(2), UART, USCI(2)

The microcontroller's connectivity options, including I2C, IRDA, SPI, UART, and USCI interfaces, enhance its compatibility and enable seamless integration with a wide range of sensors, actuators, and communication protocols.

ROM Programmability: FLASH

The microcontroller's programmable ROM, implemented using flash memory technology, enables easy and flexible firmware updates and customization, ensuring adaptability to changing system requirements.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this microcontroller supports fine-pitch connectivity, enabling high-density circuit board designs and facilitating miniaturization of electronic devices.

Format: FIXED POINT

The fixed-point format in this microcontroller ensures accurate and efficient numerical calculations, making it well-suited for applications that involve mathematical processing and algorithms.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, the microcontroller's moisture sensitivity is moderate, requiring standard handling and storage precautions during manufacturing and assembly.

Speed: 16 rpm

The microcontroller's speed of 16 revolutions per minute (rpm) enables precise control over rotating devices, such as motors or actuators, facilitating motion control and automation applications.

Low Power Mode: YES

The availability of low power mode allows the microcontroller to operate in energy-saving modes, minimizing power consumption and extending battery life in power-constrained applications.

On Chip Program ROM Width: 8

Featuring an 8-bit on-chip program ROM width, this microcontroller supports efficient program storage and execution, enhancing overall system performance.

No. of I/O Lines: 63

With 63 input/output lines, this microcontroller provides extensive connectivity options for peripheral devices, enabling versatile and scalable system designs.

Technical Specifications

Microcontrollers MSP430FR6989IPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

63

No. of Serial I/Os:

3

No. of Terminals:

80

No. of Timers:

20

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(16), CRC, DMA(3), RTC, TIMER(20), WDT"

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR6989IPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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