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MSP430FR69891IPZ

Texas Instruments

MSP430FR69891IPZ by Texas Instruments

MSP430FR69891IPZ by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 2048 RAM bytes, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring low power consumption, featuring peripherals like BOD, CRC, and DMA for efficient operation at up to 24 MHz clock frequency.

Median Price

$9.380

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,268 parts In-Stock

1+ parts

$9.380

100+ parts

$7.647

1k+ parts

$5.098

10k+ parts

-

7,268

$9.380

$7.647

$5.098

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 93 parts In-Stock

1+ parts

$8.860

100+ parts

-

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93

$8.860

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Digiode

USA . 221 parts In-Stock

1+ parts

$8.911

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-

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221

$8.911

-

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Vyrian

USA . 7,570 parts In-Stock

1+ parts

-

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7,570

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 7,163 parts In-Stock

1+ parts

$7.970

100+ parts

$7.771

1k+ parts

$7.731

10k+ parts

-

7,163

$7.970

$7.771

$7.731

-

Ampacity Inc.

Singapore . 7,130 parts In-Stock

1+ parts

$7.970

100+ parts

-

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7,130

$7.970

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Corphita

USA . 1,915 parts In-Stock

1+ parts

$8.442

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1,915

$8.442

-

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Continental Prestige Electronics

USA . 2,968 parts In-Stock

1+ parts

$8.860

100+ parts

-

1k+ parts

-

10k+ parts

$8.683

2,968

$8.860

-

-

$8.683

Corohmni

South Africa . 633 parts In-Stock

1+ parts

$8.860

100+ parts

-

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633

$8.860

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-

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$9.037

100+ parts

$9.037

1k+ parts

$9.037

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-

40

$9.037

$9.037

$9.037

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AZTECH Wire

Italy . 349 parts In-Stock

1+ parts

$9.040

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349

$9.040

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Parana Technologies

USA . 163 parts In-Stock

1+ parts

$53.969

100+ parts

$5,011.813

1k+ parts

$48.572

10k+ parts

-

163

$53.969

$5,011.813

$48.572

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DigiPath Technology Company

USA . 775 parts In-Stock

1+ parts

$59.426

100+ parts

$54.672

1k+ parts

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775

$59.426

$54.672

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IDEA Electronic Components Group

UK . 1,198 parts In-Stock

1+ parts

$60.639

100+ parts

$57.607

1k+ parts

$54.575

10k+ parts

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1,198

$60.639

$57.607

$54.575

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ChromeModa Solutions

Germany . 838 parts In-Stock

1+ parts

$60.639

100+ parts

$49.724

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838

$60.639

$49.724

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Lixinc

USA . 7,131 parts In-Stock

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7,131

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Perfect Parts

USA . 3,359 parts In-Stock

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3,359

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$8.683

1k+ parts

$8.417

10k+ parts

$8.240

2,000

-

$8.683

$8.417

$8.240

Argo Parts USA

USA . 906 parts In-Stock

1+ parts

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906

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Futuretech Components

Singapore . 720 parts In-Stock

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720

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR69891IPZ microcontroller. Designed for a wide range of applications, this cutting-edge product offers unparalleled quality and reliability. With advanced features such as low power mode, analog to digital converters, and multiple connectivity options, this microcontroller provides customers with exceptional value and performance. Trust in the industry-leading manufacturer, Texas Instruments, and elevate your projects to new heights with the MSP430FR69891IPZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to external factors, making the microcontroller suitable for a variety of environments.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for compatibility with a wide range of power sources, enhancing versatility.

CPU Family: MSP430

Being part of the MSP430 family ensures reliable performance and support from a well-established line of microcontrollers.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast processing speeds and efficient operation of the microcontroller.

Connectivity: I2C, IRDA, SPI(2), UART, USCI(2)

Multiple connectivity options allow for easy integration with various devices and systems, expanding the microcontroller's applicability.

Technical Specifications

Microcontrollers MSP430FR69891IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

83

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

20

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(16), CRC, DMA(3), RTC, TIMER(20), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR69891IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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