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MSP430FR69791IPNR

Texas Instruments

MSP430FR69791IPNR by Texas Instruments

MSP430FR69791IPNR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 2048 RAM bytes, and 16 ADC channels. Ideal for industrial applications requiring low power consumption, it features peripherals like BOR, CRC, DMA(3), and PWM. With a max clock frequency of 16 MHz and operating temperature range from -40 to 85 °C, it offers high performance in a compact package.

Median Price

$4.429

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,742 parts In-Stock

1+ parts

$4.429

100+ parts

$3.611

1k+ parts

$2.407

10k+ parts

-

7,742

$4.429

$3.611

$2.407

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 198 parts In-Stock

1+ parts

$4.208

100+ parts

-

1k+ parts

-

10k+ parts

-

198

$4.208

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Vyrian

USA . 2,097 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

2,097

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,220 parts In-Stock

1+ parts

$3.986

100+ parts

-

1k+ parts

-

10k+ parts

-

1,220

$3.986

-

-

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AZTECH Wire

Italy . 328 parts In-Stock

1+ parts

$15.140

100+ parts

-

1k+ parts

-

10k+ parts

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328

$15.140

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-

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Parana Technologies

USA . 2,062 parts In-Stock

1+ parts

$67.709

100+ parts

-

1k+ parts

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2,062

$67.709

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-

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ChromeModa Solutions

Germany . 6,707 parts In-Stock

1+ parts

$76.077

100+ parts

$62.383

1k+ parts

-

10k+ parts

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6,707

$76.077

$62.383

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IDEA Electronic Components Group

UK . 2,248 parts In-Stock

1+ parts

$76.077

100+ parts

$72.273

1k+ parts

$68.469

10k+ parts

-

2,248

$76.077

$72.273

$68.469

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DigiPath Technology Company

USA . 1,630 parts In-Stock

1+ parts

-

100+ parts

$68.591

1k+ parts

-

10k+ parts

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1,630

-

$68.591

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Overview

Unlock the power of technology with the MSP430FR69791IPNR by Texas Instruments. Crafted with precision and expertise, this microcontroller offers unparalleled quality and reliability. Ideal for a wide range of applications, this innovative device provides customers with exceptional value and benefits. Experience seamless connectivity, superior performance, and low power consumption with the MSP430FR69791IPNR. Elevate your projects to new heights with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the microcontroller lightweight and durable, ideal for portable or rugged applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of voltage sources.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle more complex data processing and calculations efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture ensures high performance and efficient operation for various embedded applications.

DMA Channels: YES

Support for DMA channels enables efficient data transfer between peripherals and memory, reducing CPU load and improving overall system performance.

Maximum Clock Frequency: 16 MHz

Operating at a high clock frequency allows for fast execution of instructions, making this microcontroller suitable for applications requiring quick response times.

ROM Programmability: FRAM

Utilizing FRAM technology allows for fast and efficient read/write operations, enhancing the overall performance of the microcontroller.

RAM Bytes: 2048

With a sufficient amount of RAM, this microcontroller can handle multiple tasks simultaneously, making it versatile for a variety of applications.

No. of I/O Lines: 83

Having a large number of I/O lines allows for connectivity to multiple external devices, expanding the capabilities of the microcontroller.

Technical Specifications

Microcontrollers MSP430FR69791IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

83

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), LCD, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR69791IPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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