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MSP430FR69791IPN

Texas Instruments

MSP430FR69791IPN by Texas Instruments

MSP430FR69791IPN by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 2048 RAM bytes, and 16 ADC channels. Ideal for industrial applications requiring low power consumption, it features peripherals like BOR, CRC, DMA(3), LCD, PWM, RTC, TIMER(5), WDT.

Median Price

$6.252

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,151 parts In-Stock

1+ parts

$6.252

100+ parts

$5.097

1k+ parts

$3.398

10k+ parts

-

9,151

$6.252

$5.097

$3.398

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 88 parts In-Stock

1+ parts

$5.939

100+ parts

-

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88

$5.939

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Vyrian

USA . 7,832 parts In-Stock

1+ parts

-

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7,832

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,413 parts In-Stock

1+ parts

$5.627

100+ parts

-

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-

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2,413

$5.627

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AZTECH Wire

Italy . 209 parts In-Stock

1+ parts

$15.430

100+ parts

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209

$15.430

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Parana Technologies

USA . 1,695 parts In-Stock

1+ parts

$61.889

100+ parts

-

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1,695

$61.889

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DigiPath Technology Company

USA . 1,765 parts In-Stock

1+ parts

$68.147

100+ parts

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1,765

$68.147

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ChromeModa Solutions

Germany . 3,752 parts In-Stock

1+ parts

$69.538

100+ parts

$57.021

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3,752

$69.538

$57.021

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IDEA Electronic Components Group

UK . 137 parts In-Stock

1+ parts

$69.538

100+ parts

$66.061

1k+ parts

$62.584

10k+ parts

-

137

$69.538

$66.061

$62.584

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Overview

Elevate your projects with the MSP430FR69791IPN microcontroller by Texas Instruments, a top-tier manufacturer known for unparalleled quality and innovation. This versatile device, part of the MSP430 CPU family, offers a wide range of applications in areas like industrial automation, consumer electronics, and more. With features like low power mode, 16-bit processing, and on-chip program ROM, this microcontroller provides exceptional value and performance. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the package, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in powering the microcontroller, making it compatible with a wide range of power sources.

Bit Size: 16

16-bit architecture provides a good balance between performance and resource utilization, making it suitable for a variety of tasks.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style saves space and allows for dense PCB designs, particularly beneficial in compact electronics.

ADC Channels: YES

Integrated Analog to Digital Converters (ADC) enable the microcontroller to interface with analog sensors, expanding its applicability in sensor-based applications.

DMA Channels: YES

Direct Memory Access (DMA) channels offload data transfer tasks from the CPU, increasing overall system efficiency and performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller design offers efficient and streamlined operation, enhancing performance and power efficiency.

ROM Programmability: FRAM

Ferroelectric RAM (FRAM) technology enables fast and reliable non-volatile memory storage, ideal for applications requiring frequent read-write operations.

Low Power Mode: YES

Low power mode functionality allows the microcontroller to conserve energy during idle periods, extending battery life in portable devices.

Technical Specifications

Microcontrollers MSP430FR69791IPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

83

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), LCD, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR69791IPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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