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MSP430FR6972IRGCT

Texas Instruments

MSP430FR6972IRGCT by Texas Instruments

MSP430FR6972IRGCT by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 8-channel 12-bit ADCs, and low power mode. Ideal for industrial applications requiring high-speed processing and connectivity via IRDA, I2C, SPI, and UART interfaces.

Median Price

$5.066

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,250 parts In-Stock

1+ parts

$5.066

100+ parts

$4.439

1k+ parts

$2.508

10k+ parts

-

1,250

$5.066

$4.439

$2.508

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,503 parts In-Stock

1+ parts

$4.813

100+ parts

-

1k+ parts

-

10k+ parts

-

3,503

$4.813

-

-

-

Vyrian

USA . 8,079 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,079

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,560 parts In-Stock

1+ parts

$4.559

100+ parts

-

1k+ parts

-

10k+ parts

-

3,560

$4.559

-

-

-

AZTECH Wire

Italy . 250 parts In-Stock

1+ parts

$11.340

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$11.340

-

-

-

Microchip USA

USA . 2,950 parts In-Stock

1+ parts

$27.990

100+ parts

$27.820

1k+ parts

$27.730

10k+ parts

$27.650

2,950

$27.990

$27.820

$27.730

$27.650

Parana Technologies

USA . 2,240 parts In-Stock

1+ parts

$30.657

100+ parts

-

1k+ parts

$69.224

10k+ parts

-

2,240

$30.657

-

$69.224

-

ChromeModa Solutions

Germany . 6,215 parts In-Stock

1+ parts

$34.446

100+ parts

$28.246

1k+ parts

-

10k+ parts

-

6,215

$34.446

$28.246

-

-

IDEA Electronic Components Group

UK . 1,068 parts In-Stock

1+ parts

$34.446

100+ parts

$32.724

1k+ parts

$31.001

10k+ parts

-

1,068

$34.446

$32.724

$31.001

-

iodParts Technologies Inc.

India . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

-

DigiPath Technology Company

USA . 1,192 parts In-Stock

1+ parts

-

100+ parts

$31.057

1k+ parts

-

10k+ parts

-

1,192

-

$31.057

-

-

Overview

Unlock endless possibilities with the MSP430FR6972IRGCT by Texas Instruments. Crafted with precision and innovation, this microcontroller redefines excellence in performance and reliability. Ideal for a wide range of applications, its advanced features and cutting-edge technology guarantee seamless operation and unparalleled efficiency. Experience the power of Texas Instruments in every project with the MSP430FR6972IRGCT - where quality meets innovation for unmatched value and benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the microcontroller a reliable choice for various applications.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and streamlining the manufacturing process.

Maximum Supply Voltage: 3.6 V

Support for a higher supply voltage allows for flexibility in power requirements.

Bit Size: 16

The 16-bit architecture provides improved performance and precision for data processing.

No. of Terminals: 64

Having a sufficient number of terminals enables connectivity with external components for versatile functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer versatility in heat dissipation and space-saving options for different applications.

Minimum Supply Voltage: 1.8 V

Support for a low supply voltage enables energy-efficient operation, crucial for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, the microcontroller can withstand harsh environmental conditions.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it suitable for a wide range of applications.

ADC Channels: YES

The built-in Analog to Digital Converters offer the capability to interface with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU workload, enhancing overall system performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections over time.

ROM Words: 65536

A large ROM allows for storing a significant amount of program data, enabling complex applications to be executed efficiently.

Maximum Seated Height: 1 mm

The low profile design with a maximum seated height of 1mm saves space in compact electronic designs.

Width: 9 mm

With a compact width, the microcontroller can be integrated into small form factor devices.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging during the manufacturing process, ensuring high quality and reliability.

Peripherals: BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

A wide range of peripherals enhances the microcontroller's versatility and functionality, allowing for diverse applications.

Maximum Clock Frequency: 24 MHz

A high clock frequency allows for fast execution of instructions and efficient operation of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient instruction execution and high performance for real-time applications.

RAM Bytes: 2048

An adequate amount of RAM allows for temporary data storage during program execution, improving overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-powered devices.

Terminal Form: NO LEAD

The no lead terminal form simplifies the manufacturing process and enhances reliability in assembly.

Analog To Digital Convertors: 8-Ch 12-Bit

With multiple high-resolution ADC channels, the microcontroller can accurately convert analog signals to digital data for processing.

Nominal Supply Voltage: 3 V

Having a nominal supply voltage of 3V ensures compatibility with common power sources and provides a stable operating voltage.

Connectivity: IRDA, I2C, SPI(2), UART

Multiple connectivity options offer flexibility in interfacing with other devices and communication protocols.

ROM Programmability: FRAM

FRAM technology allows for fast and reliable program storage and execution, enhancing overall system performance.

Terminal Pitch: 0.5 mm

Having a fine terminal pitch of 0.5mm enables high-density mounting on PCBs, saving space in compact designs.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the microcontroller can withstand moderate exposure to moisture during handling and operation.

Speed: 16 rpm

A speed of 16 rpm indicates the maximum operational speed at which the microcontroller can perform tasks efficiently.

Low Power Mode: YES

The low power mode feature allows the microcontroller to conserve energy when not in active use, extending battery life in portable devices.

On Chip Program ROM Width: 8

An on-chip program ROM width of 8 ensures efficient program storage and execution, enhancing system performance.

No. of I/O Lines: 51

Having a high number of I/O lines enables versatile interfacing with external components, expanding the microcontroller's capabilities.

Technical Specifications

Microcontrollers MSP430FR6972IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6972IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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