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MSP430FR6970IRGCR

Texas Instruments

MSP430FR6970IRGCR by Texas Instruments

MSP430FR6970IRGCR by Texas Instruments is a 16-bit microcontroller with 8-Ch 12-Bit ADC channels, 3 DMA channels, and FRAM ROM programmability. Ideal for industrial applications, it operates b/w -40 to 85 °C with low power mode support and offers various peripherals like BOR, CRC, LCD, PWM, RTC.

Median Price

$2.981

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,950 parts In-Stock

1+ parts

$2.981

100+ parts

$2.430

1k+ parts

$1.620

10k+ parts

-

1,950

$2.981

$2.430

$1.620

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,319 parts In-Stock

1+ parts

$2.832

100+ parts

-

1k+ parts

-

10k+ parts

-

3,319

$2.832

-

-

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Vyrian

USA . 5,286 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,286

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,127 parts In-Stock

1+ parts

$2.683

100+ parts

-

1k+ parts

-

10k+ parts

-

1,127

$2.683

-

-

-

Microchip USA

USA . 3,500 parts In-Stock

1+ parts

$14.742

100+ parts

-

1k+ parts

-

10k+ parts

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3,500

$14.742

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-

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AZTECH Wire

Italy . 276 parts In-Stock

1+ parts

$21.780

100+ parts

-

1k+ parts

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10k+ parts

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276

$21.780

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-

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Parana Technologies

USA . 2,098 parts In-Stock

1+ parts

$48.766

100+ parts

$4,528.641

1k+ parts

$43.889

10k+ parts

-

2,098

$48.766

$4,528.641

$43.889

-

DigiPath Technology Company

USA . 2,146 parts In-Stock

1+ parts

$53.697

100+ parts

-

1k+ parts

-

10k+ parts

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2,146

$53.697

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IDEA Electronic Components Group

UK . 1,027 parts In-Stock

1+ parts

$54.793

100+ parts

$52.053

1k+ parts

$49.314

10k+ parts

-

1,027

$54.793

$52.053

$49.314

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ChromeModa Solutions

Germany . 857 parts In-Stock

1+ parts

$54.793

100+ parts

$44.930

1k+ parts

-

10k+ parts

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857

$54.793

$44.930

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR6970IRGCR microcontroller. Featuring cutting-edge technology and top-notch quality, this versatile chip offers a wide range of applications in various industries. With its low power mode and high-speed performance, this microcontroller provides unmatched value and benefits to customers looking for reliable solutions. Whether you're working on IoT devices, consumer electronics, or industrial automation, the MSP430FR6970IRGCR is the perfect choice for your next project. Embrace efficiency and performance with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power requirements effectively.

Package Shape: SQUARE

Square package shape provides a compact design, making it easier to fit into tight spaces on the circuit board.

Bit Size: 16

16-bit architecture allows for more complex calculations and processing capabilities compared to lower bit sizes.

No. of Terminals: 64

With 64 terminals, this microcontroller has ample I/O options for connecting to external devices and sensors.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offer efficient heat dissipation and space-saving benefits.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for power-efficient operation in applications where energy consumption is critical.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions without performance degradation.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption, making it ideal for battery-operated and energy-efficient applications.

Minimum Operating Temperature: -40 °C

Operating down to -40°C allows this microcontroller to function in extreme cold environments without issues.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Built-in ADC channels enable analog signal conversion, expanding the range of applications this microcontroller can be used in.

DMA Channels: YES

DMA channels allow for efficient data transfer within the microcontroller and between external devices, improving overall system performance.

Terminal Position: QUAD

Quad terminal position offers a standardized layout for easy integration into PCB designs and connections to other components.

ROM Words: 32768

With 32K ROM words, this microcontroller provides ample storage capacity for program data and instructions.

Maximum Seated Height: 1 mm

Low seated height allows for a compact overall design, reducing the profile of the PCB and enabling space-efficient layouts.

Width: 9 mm

A width of 9 mm ensures compatibility with standard PCB designs and mounting configurations, simplifying integration into existing systems.

Boundary Scan: YES

Boundary scan feature enables efficient testing and debugging of the microcontroller during production and maintenance phases.

Peripherals: BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

A wide range of peripherals including comparators, PWM, timers, and more enhance the functionality and versatility of the microcontroller.

Maximum Clock Frequency: 24 MHz

High clock frequency of 24 MHz allows for fast processing speeds, making this microcontroller suitable for real-time applications.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable soldering during assembly, preventing joint failures and ensuring PCB integrity.

Length: 9 mm

A length of 9 mm provides a balanced form factor, making it easy to integrate this microcontroller into various PCB layouts and designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh industrial environments with fluctuating temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient processing and low power consumption, ideal for embedded systems and IoT applications.

RAM Bytes: 2048

With 2K RAM bytes, this microcontroller provides sufficient memory for data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the microcontroller.

Terminal Form: NO LEAD

No lead terminal form simplifies the manufacturing process and enhances solder joint reliability for long-term performance.

Analog To Digital Convertors: 8-Ch 12-Bit

8-channel 12-bit ADCs provide precise analog signal conversion, making this microcontroller suitable for sensor interfacing and data acquisition applications.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3V ensures consistent and reliable operation of the microcontroller in various applications.

No. of DMA Channels: 3

3 DMA channels offer efficient data transfer and processing capabilities, improving system performance and responsiveness.

Connectivity: IRDA, I2C, SPI(2), UART

Multiple connectivity options including IRDA, I2C, SPI, and UART allow for seamless communication with external devices and peripherals.

ROM Programmability: FRAM

FRAM ROM programmability ensures fast and reliable program storage and execution, enhancing overall system performance and longevity.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting and enhanced signal integrity, improving overall reliability and performance.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates that this microcontroller can withstand moderate exposure to moisture during storage and assembly processes.

Speed: 16 rpm

With a speed of 16 rpm, this microcontroller offers efficient processing capabilities for a wide range of applications, including motor control and automation.

Low Power Mode: YES

Low power mode functionality enables energy-efficient operation, extending battery life and reducing overall power consumption in portable and IoT devices.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width provides sufficient storage capacity for program code and data, supporting complex algorithms and applications.

No. of I/O Lines: 51

51 I/O lines offer versatile connectivity options for interfacing with external devices and peripherals, enhancing the overall functionality of the microcontroller.

Technical Specifications

Microcontrollers MSP430FR6970IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6970IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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