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MSP430FR6927IPMR

Texas Instruments

MSP430FR6927IPMR by Texas Instruments

MSP430FR6927IPMR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features FRAM ROM programmability, 8-channel ADC, and low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$3.586

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,060 parts In-Stock

1+ parts

$3.586

100+ parts

$3.142

1k+ parts

$1.775

10k+ parts

-

5,060

$3.586

$3.142

$1.775

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,257 parts In-Stock

1+ parts

$3.407

100+ parts

-

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-

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4,257

$3.407

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Vyrian

USA . 7,296 parts In-Stock

1+ parts

-

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-

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7,296

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Distributors (Availability)

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Corphita

USA . 4,443 parts In-Stock

1+ parts

$3.227

100+ parts

-

1k+ parts

-

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4,443

$3.227

-

-

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AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$8.440

100+ parts

-

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744

$8.440

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-

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Parana Technologies

USA . 2,313 parts In-Stock

1+ parts

$20.914

100+ parts

-

1k+ parts

$21.109

10k+ parts

-

2,313

$20.914

-

$21.109

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ChromeModa Solutions

Germany . 6,760 parts In-Stock

1+ parts

$23.499

100+ parts

$19.269

1k+ parts

-

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6,760

$23.499

$19.269

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IDEA Electronic Components Group

UK . 2,261 parts In-Stock

1+ parts

$23.499

100+ parts

$22.324

1k+ parts

$21.149

10k+ parts

-

2,261

$23.499

$22.324

$21.149

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QUARKTWIN TECHNOLOGY LTD

USA . 27,809 parts In-Stock

1+ parts

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27,809

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DigiPath Technology Company

USA . 1,640 parts In-Stock

1+ parts

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$21.187

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1,640

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$21.187

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A-Z Elektronik GmbH

Germany . 1,500 parts In-Stock

1+ parts

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1,500

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Kepictronics

USA . 1,180 parts In-Stock

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1,180

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Component Stockers USA

USA . 296 parts In-Stock

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296

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Metaverse IC Inc.

Canada . 280 parts In-Stock

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280

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Overview

Experience the next level of performance with the MSP430FR6927IPMR by Texas Instruments. This cutting-edge microcontroller offers unparalleled quality and reliability, setting the standard in the industry. Ideal for a wide range of applications, this device is designed to meet your needs with its advanced features and innovative technology. Trust in Texas Instruments to deliver top-notch products that provide value, benefits, and advantages to customers like you. Take your projects to new heights with the MSP430FR6927IPMR - the ultimate choice for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and lightweight design, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and making assembly simpler.

Maximum Supply Voltage: 3.6 V

Supports a wide range of input voltages, providing flexibility in power supply options.

Bit Size: 16

Offers high computational capabilities and precision in processing data and instructions.

No. of Terminals: 64

Provides ample connection points for interfacing with external components and peripherals.

Minimum Supply Voltage: 1.8 V

Allows for operation in low power scenarios or battery-powered applications.

Maximum Operating Temperature: 85 °C

Ensures reliability and stability in a wide range of operating environments.

CPU Family: MSP430

Comes from a trusted and reputable family of microcontrollers known for performance and efficiency.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with sensors and other analog devices.

DMA Channels: YES

Facilitates efficient data transfer between memory and peripherals, improving overall system performance.

ROM Words: 65536

Provides ample storage for program instructions and data, allowing for versatile applications.

Maximum Clock Frequency: 16 MHz

Supports high-speed processing and operation, suitable for real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient and streamlined instruction execution.

RAM Bytes: 2048

Offers sufficient memory for data storage and manipulation during operation.

Analog To Digital Convertors: 8-Ch 12-Bit

Provides multiple channels for analog input conversion with high resolution.

Nominal Supply Voltage: 3 V

Specifies the recommended operating voltage for optimal performance and reliability.

Technical Specifications

Microcontrollers MSP430FR6927IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), LCD, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6927IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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