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MSP430FR6927IPM

Texas Instruments

MSP430FR6927IPM by Texas Instruments

MSP430FR6927IPM by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features 8 ADC channels, 3 DMA channels, and peripherals like BOR, CRC, and LCD. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$5.641

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,970 parts In-Stock

1+ parts

$5.062

100+ parts

$4.436

1k+ parts

$2.506

10k+ parts

-

2,970

$5.062

$4.436

$2.506

-

DigiKey

USA . 157 parts In-Stock

1+ parts

$6.220

100+ parts

$4.414

1k+ parts

-

10k+ parts

-

157

$6.220

$4.414

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,734 parts In-Stock

1+ parts

$4.809

100+ parts

-

1k+ parts

-

10k+ parts

-

1,734

$4.809

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Vyrian

USA . 2,939 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,939

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 120 parts In-Stock

1+ parts

$4.556

100+ parts

-

1k+ parts

-

10k+ parts

-

120

$4.556

-

-

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Parana Technologies

USA . 324 parts In-Stock

1+ parts

$69.602

100+ parts

-

1k+ parts

-

10k+ parts

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324

$69.602

-

-

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DigiPath Technology Company

USA . 28 parts In-Stock

1+ parts

$76.640

100+ parts

$70.509

1k+ parts

-

10k+ parts

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28

$76.640

$70.509

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-

IDEA Electronic Components Group

UK . 254 parts In-Stock

1+ parts

$78.204

100+ parts

$74.294

1k+ parts

$70.384

10k+ parts

-

254

$78.204

$74.294

$70.384

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ChromeModa Solutions

Germany . 35 parts In-Stock

1+ parts

$78.204

100+ parts

$64.127

1k+ parts

-

10k+ parts

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35

$78.204

$64.127

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Overview

Unlock the potential of your projects with the MSP430FR6927IPM microcontroller by Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this microcontroller offers low power consumption and versatile connectivity options, making it a valuable asset for any project. Experience the benefits of its advanced features, including analog to digital converters, PWM channels, and on-chip program ROM, all while enjoying the reliability and performance that Texas Instruments is renowned for. Elevate your designs with the MSP430FR6927IPM and see your projects flourish.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on circuit boards, saving space and enabling automated assembly.

Bit Size: 16

16-bit architecture provides higher processing capabilities and performance compared to lower bit sizes.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can function reliably even in demanding industrial environments.

ADC Channels: YES

Integrated Analog to Digital Converters enable accurate and efficient conversion of analog signals to digital data, expanding the capabilities of the microcontroller.

Peripherals: BOR, COMPARATOR(16), CRC, DMA(3), LCD, PWM, RTC, TIMER(5), WDT

The variety of supported peripherals, including timers, comparators, PWM, and DMA channels, enhance the functionality and versatility of this microcontroller for different applications.

Speed: 16 rpm

With a maximum clock frequency of 16 MHz, this microcontroller can execute instructions at high speeds, improving overall performance.

RAM Bytes: 2048

The ample amount of RAM allows for efficient data storage and manipulation during program execution, enhancing the microcontroller's capabilities.

Technical Specifications

Microcontrollers MSP430FR6927IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), CRC, DMA(3), LCD, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6927IPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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