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MSP430FR6922IPMR

Texas Instruments

MSP430FR6922IPMR by Texas Instruments

MSP430FR6922IPMR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at max 24 MHz. It features 8 ADC channels, 3 DMA channels, and FRAM ROM programmability. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$4.713

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,995 parts In-Stock

1+ parts

$3.836

100+ parts

$3.128

1k+ parts

$2.085

10k+ parts

-

5,995

$3.836

$3.128

$2.085

-

Mouser Electronics

USA . 990 parts In-Stock

1+ parts

$5.590

100+ parts

$4.730

1k+ parts

$3.330

10k+ parts

-

990

$5.590

$4.730

$3.330

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,131 parts In-Stock

1+ parts

$3.644

100+ parts

-

1k+ parts

-

10k+ parts

-

3,131

$3.644

-

-

-

Vyrian

USA . 2,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,985

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,173 parts In-Stock

1+ parts

$3.452

100+ parts

-

1k+ parts

-

10k+ parts

-

4,173

$3.452

-

-

-

Microchip USA

USA . 2,368 parts In-Stock

1+ parts

$19.922

100+ parts

-

1k+ parts

-

10k+ parts

-

2,368

$19.922

-

-

-

Parana Technologies

USA . 1,952 parts In-Stock

1+ parts

$75.509

100+ parts

-

1k+ parts

-

10k+ parts

-

1,952

$75.509

-

-

-

ChromeModa Solutions

Germany . 1,747 parts In-Stock

1+ parts

$84.842

100+ parts

$69.570

1k+ parts

-

10k+ parts

-

1,747

$84.842

$69.570

-

-

IDEA Electronic Components Group

UK . 681 parts In-Stock

1+ parts

$84.842

100+ parts

$80.600

1k+ parts

$76.358

10k+ parts

-

681

$84.842

$80.600

$76.358

-

Lixinc

USA . 15,981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,981

-

-

-

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DigiPath Technology Company

USA . 2,328 parts In-Stock

1+ parts

-

100+ parts

$76.494

1k+ parts

-

10k+ parts

-

2,328

-

$76.494

-

-

Overview

Unlock the potential of your innovative projects with the MSP430FR6922IPMR microcontroller by Texas Instruments. This high-quality device offers unmatched performance and reliability, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value and advanced features that will take your designs to the next level. Trust Texas Instruments for superior technology and unleash the power of the MSP430FR6922IPMR in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for efficient and space-saving PCB design.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V offers flexibility in power options.

Package Shape: SQUARE

Square shape helps in easy integration and placement on the PCB.

Bit Size: 16

16-bit architecture provides enhanced performance and data processing capabilities.

No. of Terminals: 64

Having 64 terminals allows for sufficient I/O connections for various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style offers improved thermal performance and space efficiency.

Minimum Supply Voltage: 1.8 V

The ability to operate at a minimum supply voltage of 1.8V enables low-power operation.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the microcontroller can withstand industrial environments.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility and support from existing MSP430 development tools.

Minimum Operating Temperature: -40 °C

Capable of operating at -40°C, making it suitable for a wide range of temperature conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold terminal finish offers high reliability and corrosion resistance.

ADC Channels: YES

Built-in ADC channels provide analog input capabilities for sensor interfacing.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU load.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connection to the PCB.

ROM Words: 65536

Large ROM capacity of 65536 words for program storage.

Maximum Seated Height: 1.6 mm

Low profile design with a maximum seated height of 1.6mm saves PCB space.

Width: 10 mm

Compact width of 10mm enables placement in space-constrained designs.

Boundary Scan: YES

Support for Boundary Scan technology allows for easier debugging and testing of the microcontroller.

Peripherals: BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

A wide range of peripherals including LCD support, timers, PWM, and more enhance the functionality of the microcontroller.

Maximum Clock Frequency: 24 MHz

High maximum clock frequency of 24MHz for fast processing and response times.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable soldering during assembly.

Length: 10 mm

Compact length of 10mm for space-efficient PCB layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller design provide efficient processing and control capabilities.

RAM Bytes: 2048

Generous RAM capacity of 2048 bytes for data storage and manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and mechanical stability.

Analog To Digital Convertors: 8-Ch 12-Bit

8-channel 12-bit ADCs offer accurate analog-to-digital conversion for sensor inputs.

Nominal Supply Voltage: 3 V

Support for a nominal supply voltage of 3V for compatibility with common power sources.

No. of DMA Channels: 3

Having 3 DMA channels improves data transfer speed and efficiency.

Connectivity: IRDA, I2C, SPI(2), UART

Multiple connectivity options including IRDA, I2C, SPI, and UART for versatile communication interfaces.

ROM Programmability: FRAM

FRAM ROM programmability ensures fast and reliable program storage and execution.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm for compact PCB design and space efficiency.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the component can withstand multiple reflow cycles.

Speed: 16 rpm

Operates at a speed of 16 RPM for consistent and reliable performance.

Low Power Mode: YES

Support for low power mode enhances energy efficiency and battery life.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits for efficient program storage and execution.

No. of I/O Lines: 52

Having 52 I/O lines provides ample connectivity for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MSP430FR6922IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6922IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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