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MSP430FR6922IPM

Texas Instruments

MSP430FR6922IPM by Texas Instruments

MSP430FR6922IPM by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 8-channel ADC, and low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$4.594

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,670 parts In-Stock

1+ parts

$4.594

100+ parts

$3.746

1k+ parts

$2.497

10k+ parts

-

5,670

$4.594

$3.746

$2.497

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,780 parts In-Stock

1+ parts

$4.364

100+ parts

-

1k+ parts

-

10k+ parts

-

2,780

$4.364

-

-

-

Vyrian

USA . 2,663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,663

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,880 parts In-Stock

1+ parts

$4.135

100+ parts

-

1k+ parts

-

10k+ parts

-

2,880

$4.135

-

-

-

AZTECH Wire

Italy . 512 parts In-Stock

1+ parts

$17.590

100+ parts

-

1k+ parts

-

10k+ parts

-

512

$17.590

-

-

-

Microchip USA

USA . 2,617 parts In-Stock

1+ parts

$31.970

100+ parts

$31.770

1k+ parts

$31.670

10k+ parts

$31.570

2,617

$31.970

$31.770

$31.670

$31.570

Parana Technologies

USA . 2,040 parts In-Stock

1+ parts

$41.336

100+ parts

-

1k+ parts

-

10k+ parts

-

2,040

$41.336

-

-

-

DigiPath Technology Company

USA . 1,807 parts In-Stock

1+ parts

$45.516

100+ parts

$41.875

1k+ parts

-

10k+ parts

-

1,807

$45.516

$41.875

-

-

ChromeModa Solutions

Germany . 5,316 parts In-Stock

1+ parts

$46.445

100+ parts

$38.085

1k+ parts

-

10k+ parts

-

5,316

$46.445

$38.085

-

-

IDEA Electronic Components Group

UK . 370 parts In-Stock

1+ parts

$46.445

100+ parts

$44.123

1k+ parts

$41.800

10k+ parts

-

370

$46.445

$44.123

$41.800

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Component Stockers USA

USA . 1,568 parts In-Stock

1+ parts

$62.230

100+ parts

-

1k+ parts

-

10k+ parts

-

1,568

$62.230

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-

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Overview

Discover the Texas Instruments MSP430FR6922IPM, a top-tier microcontroller that delivers unparalleled performance and reliability. With a reputation for excellence, Texas Instruments ensures superior quality in every aspect of their products. Ideal for a wide range of applications, this microcontroller boasts advanced features like low power mode, analog to digital converters, and multiple connectivity options. Unlock endless possibilities with the MSP430FR6922IPM, offering customers exceptional value, efficiency, and innovation in one compact package. Elevate your projects to new heights with this cutting-edge microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight and cost-effective.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while ensuring safe operation within the specified voltage range.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it suitable for a wide range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC architecture microcontroller with various built-in peripherals, it offers efficient and streamlined processing for embedded systems.

RAM Bytes: 2048

With a decent amount of RAM, the microcontroller can handle multiple tasks simultaneously and efficiently.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microcontroller suitable for battery-operated devices and noise-sensitive applications.

Analog To Digital Convertors: 8-Ch 12-Bit

Having 8 analog to digital converters with 12-bit resolution enables accurate and precise analog measurements for sensor interfacing and data acquisition.

Connectivity: IRDA, I2C, SPI(2), UART

Support for multiple communication interfaces like IRDA, I2C, SPI, and UART allows easy integration with other devices and peripherals.

Technical Specifications

Microcontrollers MSP430FR6922IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6922IPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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