Loading...

MSP430FR6922IG56

Texas Instruments

MSP430FR6922IG56 by Texas Instruments

MSP430FR6922IG56 by Texas Instruments is a 16-bit microcontroller with 52 I/O lines, 8 ADC channels, and 3 DMA channels. It operates at speeds up to 24 MHz, suitable for industrial applications requiring low power consumption. The package style is small outline with a max seated height of 1.2 mm, making it ideal for compact designs in harsh environments.

Median Price

$4.558

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,350 parts In-Stock

1+ parts

$4.558

100+ parts

$3.716

1k+ parts

$2.477

10k+ parts

-

5,350

$4.558

$3.716

$2.477

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,667 parts In-Stock

1+ parts

$4.330

100+ parts

-

1k+ parts

-

10k+ parts

-

3,667

$4.330

-

-

-

Vyrian

USA . 5,885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,885

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,665 parts In-Stock

1+ parts

$4.102

100+ parts

-

1k+ parts

-

10k+ parts

-

4,665

$4.102

-

-

-

AZTECH Wire

Italy . 115 parts In-Stock

1+ parts

$15.560

100+ parts

-

1k+ parts

-

10k+ parts

-

115

$15.560

-

-

-

Microchip USA

USA . 2,586 parts In-Stock

1+ parts

$31.710

100+ parts

$31.510

1k+ parts

$31.420

10k+ parts

$31.320

2,586

$31.710

$31.510

$31.420

$31.320

Parana Technologies

USA . 1,869 parts In-Stock

1+ parts

$36.690

100+ parts

-

1k+ parts

-

10k+ parts

-

1,869

$36.690

-

-

-

DigiPath Technology Company

USA . 1,155 parts In-Stock

1+ parts

$40.400

100+ parts

$37.168

1k+ parts

-

10k+ parts

-

1,155

$40.400

$37.168

-

-

IDEA Electronic Components Group

UK . 1,263 parts In-Stock

1+ parts

$41.225

100+ parts

$39.164

1k+ parts

$37.102

10k+ parts

-

1,263

$41.225

$39.164

$37.102

-

ChromeModa Solutions

Germany . 381 parts In-Stock

1+ parts

$41.225

100+ parts

$33.804

1k+ parts

-

10k+ parts

-

381

$41.225

$33.804

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 2,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,253

-

-

-

-

Overview

Unlock the power of Texas Instruments with the MSP430FR6922IG56 microcontroller. This small yet mighty device offers unmatched quality and reliability, perfect for a wide range of applications. With features like low power mode, multiple ADC channels, and high clock frequency, this microcontroller provides exceptional value to customers looking for top-notch performance. Whether you're working on IoT devices, industrial automation, or consumer electronics, the MSP430FR6922IG56 has got you covered. Trust Texas Instruments to deliver excellence in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments and conditions.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for more flexibility in power supply options.

Bit Size: 16

With a 16-bit architecture, the microcontroller can handle larger data sets and perform more complex operations efficiently.

ADC Channels: YES

Having analog to digital converters allows the microcontroller to interface with analog sensors and inputs, expanding its capabilities.

ROM Words: 65536

With a large ROM capacity, the microcontroller can store and execute more program instructions, enabling more complex functions.

Maximum Clock Frequency: 24 MHz

A high clock frequency enables fast processing speeds, making the microcontroller suitable for applications that require quick response times.

RAM Bytes: 2048

Having a decent amount of RAM allows the microcontroller to store and manipulate data efficiently, improving overall performance.

Connectivity: IRDA, I2C, SPI(2), UART

Support for multiple communication protocols enables the microcontroller to easily interface with other devices, expanding its compatibility and versatility.

Technical Specifications

Microcontrollers MSP430FR6922IG56 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

52

No. of Terminals:

56

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6922IG56 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20