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MSP430FR69221IPMR

Texas Instruments

MSP430FR69221IPMR by Texas Instruments

MSP430FR69221IPMR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 8-channel ADC, and low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$3.836

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,950 parts In-Stock

1+ parts

$3.836

100+ parts

$3.128

1k+ parts

$2.085

10k+ parts

-

4,950

$3.836

$3.128

$2.085

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,550 parts In-Stock

1+ parts

$3.644

100+ parts

-

1k+ parts

-

10k+ parts

-

1,550

$3.644

-

-

-

Vyrian

USA . 4,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,585

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,185 parts In-Stock

1+ parts

$3.452

100+ parts

-

1k+ parts

-

10k+ parts

-

1,185

$3.452

-

-

-

AZTECH Wire

Italy . 968 parts In-Stock

1+ parts

$13.610

100+ parts

-

1k+ parts

-

10k+ parts

-

968

$13.610

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-

-

Microchip USA

USA . 1,033 parts In-Stock

1+ parts

$19.160

100+ parts

$19.050

1k+ parts

$18.990

10k+ parts

$18.930

1,033

$19.160

$19.050

$18.990

$18.930

Parana Technologies

USA . 842 parts In-Stock

1+ parts

$76.203

100+ parts

$7,076.576

1k+ parts

$68.582

10k+ parts

-

842

$76.203

$7,076.576

$68.582

-

DigiPath Technology Company

USA . 819 parts In-Stock

1+ parts

$83.909

100+ parts

-

1k+ parts

-

10k+ parts

-

819

$83.909

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-

-

ChromeModa Solutions

Germany . 4,273 parts In-Stock

1+ parts

$85.621

100+ parts

$70.209

1k+ parts

-

10k+ parts

-

4,273

$85.621

$70.209

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IDEA Electronic Components Group

UK . 2,139 parts In-Stock

1+ parts

$85.621

100+ parts

$81.340

1k+ parts

$77.059

10k+ parts

-

2,139

$85.621

$81.340

$77.059

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430FR69221IPMR microcontroller. Built with precision and expertise, this device offers unparalleled quality and reliability in a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers unmatched performance and efficiency. Experience the benefits of low power consumption, high-speed processing, and versatile connectivity options. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the MSP430FR69221IPMR and discover endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

No. of Terminals: 64

With 64 terminals, this microcontroller offers a wide range of connectivity options for peripherals and external devices.

ROM Words: 65536

Large ROM capacity of 65536 words allows for storing and executing complex programs and data efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller enhances processing speed and performance, making it suitable for real-time applications.

Analog To Digital Convertors: 8-Ch 12-Bit

8-channel 12-bit ADC enables precise conversion of analog signals to digital data, essential for sensing and data acquisition applications.

Connectivity: IRDA, I2C, SPI(2), UART

Multiple communication interfaces such as IRDA, I2C, SPI, and UART provide versatile connectivity options for interfacing with other devices and systems.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption during idle or low activity periods, improving energy efficiency.

Technical Specifications

Microcontrollers MSP430FR69221IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR69221IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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