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MSP430FR69221IG56

Texas Instruments

MSP430FR69221IG56 by Texas Instruments

MSP430FR69221IG56 by Texas Instruments is a 16-bit microcontroller with 65536 ROM words, 2048 RAM bytes, and 8-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features peripherals like BOR, CRC, DMA(3), LCD, PWM, and UART connectivity. Operating temperature ranges from -40 to 85 °C with a max clock frequency of 24 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,698 parts In-Stock

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5,698

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Digiode

USA . 3,880 parts In-Stock

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3,880

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Distributors (Availability)

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One Stop Electronics

USA . 769 parts In-Stock

1+ parts

$13.000

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769

$13.000

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AZTECH Wire

Italy . 550 parts In-Stock

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$13.535

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550

$13.535

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Microchip USA

USA . 1,410 parts In-Stock

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$31.710

100+ parts

$31.510

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$31.420

10k+ parts

$31.320

1,410

$31.710

$31.510

$31.420

$31.320

Parana Technologies

USA . 2,142 parts In-Stock

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$41.105

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2,142

$41.105

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DigiPath Technology Company

USA . 62 parts In-Stock

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$45.261

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62

$45.261

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ChromeModa Solutions

Germany . 6,227 parts In-Stock

1+ parts

$46.185

100+ parts

$37.872

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6,227

$46.185

$37.872

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IDEA Electronic Components Group

UK . 403 parts In-Stock

1+ parts

$46.185

100+ parts

$43.876

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$41.566

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403

$46.185

$43.876

$41.566

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Corphita

USA . 3,459 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP430FR69221IG56 microcontroller. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability. This microcontroller is versatile, offering a wide range of applications in various industries. With its advanced features and low power consumption, the MSP430FR69221IG56 provides unmatched value and benefits to customers looking for high-performance solutions. Upgrade your projects with this cutting-edge technology and experience exceptional performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and simplifying production processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power requirements for various projects.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement on circuit boards and efficient use of board space.

Bit Size: 16

16-bit architecture provides sufficient processing power for a wide range of applications.

No. of Terminals: 56

The large number of terminals allows for versatile connectivity options and interfacing with external components.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and execution of instructions, making the microcontroller a high-performance choice.

RAM Bytes: 2048

Ample RAM capacity allows for efficient data storage and processing, accommodating complex algorithms and applications.

ADC Channels: YES

Integrated analog-to-digital converters enable the microcontroller to interface with analog sensors and devices, expanding its capabilities.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and efficiency, improving overall performance of the microcontroller.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast processing and execution of instructions, making the microcontroller suitable for tasks requiring real-time responsiveness.

Technical Specifications

Microcontrollers MSP430FR69221IG56 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

52

No. of Terminals:

56

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR69221IG56 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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