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MSP430FR6920IRGCR

Texas Instruments

MSP430FR6920IRGCR by Texas Instruments

MSP430FR6920IRGCR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. Featuring FRAM ROM programmability, it offers 8 ADC channels and 3 DMA channels for applications requiring low power consumption in industrial temperature environments.

Median Price

$2.973

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,500 parts In-Stock

1+ parts

$2.973

100+ parts

$2.424

1k+ parts

$1.616

10k+ parts

-

13,500

$2.973

$2.424

$1.616

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,394 parts In-Stock

1+ parts

$2.824

100+ parts

-

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-

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1,394

$2.824

-

-

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Vyrian

USA . 2,826 parts In-Stock

1+ parts

-

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2,826

-

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Nova Conductors

Japan . 100 parts In-Stock

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-

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100

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 13,256 parts In-Stock

1+ parts

$2.530

100+ parts

-

1k+ parts

-

10k+ parts

-

13,256

$2.530

-

-

-

Corphita

USA . 1,431 parts In-Stock

1+ parts

$2.676

100+ parts

-

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-

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1,431

$2.676

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-

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AZTECH Wire

Italy . 1,063 parts In-Stock

1+ parts

$13.890

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1,063

$13.890

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Microchip USA

USA . 2,534 parts In-Stock

1+ parts

$14.110

100+ parts

$14.020

1k+ parts

$13.980

10k+ parts

$13.940

2,534

$14.110

$14.020

$13.980

$13.940

Corohmni

South Africa . 463 parts In-Stock

1+ parts

$15.992

100+ parts

-

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-

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463

$15.992

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Parana Technologies

USA . 1,598 parts In-Stock

1+ parts

$24.892

100+ parts

-

1k+ parts

$25.586

10k+ parts

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1,598

$24.892

-

$25.586

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DigiPath Technology Company

USA . 850 parts In-Stock

1+ parts

$27.410

100+ parts

$25.217

1k+ parts

-

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850

$27.410

$25.217

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ChromeModa Solutions

Germany . 2,186 parts In-Stock

1+ parts

$27.969

100+ parts

$22.935

1k+ parts

-

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2,186

$27.969

$22.935

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IDEA Electronic Components Group

UK . 610 parts In-Stock

1+ parts

$27.969

100+ parts

$26.571

1k+ parts

$25.172

10k+ parts

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610

$27.969

$26.571

$25.172

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Continental Prestige Electronics

USA . 5,758 parts In-Stock

1+ parts

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5,758

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Argo Parts USA

USA . 3,870 parts In-Stock

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3,870

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR6920IRGCR microcontroller. Designed with cutting-edge technology, this versatile chip offers unmatched performance in a wide range of applications. From IoT devices to consumer electronics, this microcontroller provides high-quality, reliable solutions for all your project needs. Trust in Texas Instruments' reputation for excellence and experience the value and benefits that the MSP430FR6920IRGCR can bring to your next design. Level up your projects with this top-of-the-line microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging ensures longer lifespan of the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows the microcontroller to handle higher supply voltages, making it versatile for a range of applications.

Bit Size: 16

Larger bit size allows for more complex operations and calculations to be performed by the microcontroller.

ADC Channels: YES

Built-in Analog to Digital Converters provide the ability to interface with analog sensors and signals.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing, making the microcontroller suitable for high-performance applications.

ROM Words: 32768

Large ROM size allows for storing a significant amount of program code and data.

Maximum Clock Frequency: 24 MHz

High clock frequency enables quick execution of instructions, making the microcontroller suitable for real-time applications.

RAM Bytes: 2048

Adequate RAM size for storing data and variables during program execution.

Connectivity: IRDA, I2C, SPI(2), UART

Multiple connectivity options enable easy communication with other devices and peripherals.

Technical Specifications

Microcontrollers MSP430FR6920IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6920IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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