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MSP430FR6879IPNR

Texas Instruments

MSP430FR6879IPNR by Texas Instruments

MSP430FR6879IPNR by Texas Instruments is a 16-bit microcontroller with a max clock frequency of 24 MHz. It features 131072 ROM words, 2048 RAM bytes, and 12-ch 12-bit ADC channels. This microcontroller is commonly used in industrial applications requiring low power mode and connectivity through EUSCI(4).

Median Price

$4.429

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Texas Instruments

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$3.611

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$2.407

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$4.429

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Nova Conductors

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50

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Digiode

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$4.208

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Argo Parts USA

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Continental Prestige Electronics

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$3.636

3,685

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$3.636

Corohmni

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$3.666

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Advanced Electronics

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Overview

Experience the power and innovation of Texas Instruments with the MSP430FR6879IPNR microcontroller. As a leader in the industry, Texas Instruments delivers unmatched quality and reliability. Designed for a wide range of applications, this microcontroller offers endless possibilities. With its advanced features and cutting-edge technology, it provides customers with exceptional value and benefits. From its low power mode to its high-speed performance, the MSP430FR6879IPNR is the perfect choice for any project. Discover the advantages of this top-of-the-line microcontroller and unlock the potential of your designs with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material enhances the durability and reliability of the microcontroller, making it suitable for various environments.

Surface Mount: YES

The surface mount feature allows for easy integration and reduced PCB size, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, offering versatility and compatibility with different power sources.

On Chip Data RAM Width: 8

The 8-bit width of the on-chip data RAM enables efficient data processing and storage, ensuring swift execution of tasks and improved performance.

Package Shape: SQUARE

The square package shape facilitates easy mounting and placement, making it convenient for manufacturing processes and enabling space-efficient designs.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle complex computations and provide enhanced precision, making it suitable for applications requiring high computational power.

No. of Terminals: 80

The ample number of terminals allows for versatile I/O connections, enabling the microcontroller to interface with a wide range of peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures efficient heat dissipation, space-saving design, and accurate placement on the PCB, making it an excellent choice for compact and high-density circuits.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage requirement enables energy-efficient operation, making it suitable for battery-powered applications and reducing overall power consumption.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, ensuring reliable performance in demanding applications.

CPU Family: MSP430

The MSP430 CPU family offers low power consumption, high processing capability, and a wide range of integrated peripherals, making it a popular and reliable choice for various embedded systems.

Minimum Operating Temperature: -40 °C

The microcontroller's ability to operate at low temperatures allows for deployment in cold environments without compromising functionality or reliability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish ensures improved corrosion resistance, excellent solderability, and stable electrical connections, guaranteeing long-term reliability.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and accurately capture real-world signals, expanding the range of potential applications.

DMA Channels: YES

The inclusion of DMA channels allows for direct memory access, optimizing data transfer speed and offloading the CPU, resulting in efficient multitasking and improved overall system performance.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and connection, ensuring reliable electrical connections and streamlining the manufacturing process.

ROM Words: 131072

The generous amount of ROM words provides ample space for program storage, accommodating larger and more complex applications.

Maximum Seated Height: 1.6 mm

With a low maximum seated height, this microcontroller is suitable for compact devices and helps to minimize overall system size.

RAM Words: 2

Although modest in size, the 2 RAM words provide sufficient work area for temporary data storage, allowing for efficient data manipulation and processing.

Width: 12 mm

The microcontroller's compact width simplifies PCB layout and allows for space-efficient designs, enabling integration into small form factor devices.

Boundary Scan: YES

The inclusion of boundary scan support enables efficient testing and debugging of the microcontroller, streamlining the development process and ensuring high product quality.

Peripherals: BOR, COMPARATOR(16), DMA(3), LCD, POR, RTC, TIMER(5), WDT

The extensive range of integrated peripherals, including a brownout reset, comparators, DMA channels, LCD controller, power-on reset, real-time clock, timers, and watchdog timer, enhances the microcontroller's versatility and makes it suitable for a wide range of applications.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency ensures fast execution of instructions and enables real-time processing, making it suitable for time-critical applications.

Peak Reflow Temperature °C: 260

The microcontroller's ability to withstand a high peak reflow temperature simplifies the manufacturing process, ensuring proper soldering and reliable connections during assembly.

Length: 12 mm

The microcontroller's compact length simplifies PCB layout and allows for space-efficient designs, enabling integration into small form factor devices.

Temperature Grade: INDUSTRIAL

The microcontroller's industrial temperature grade ensures reliable operation across a wide temperature range, making it suitable for industrial applications where temperature variations are common.

Peripheral IC Type: MICROCONTROLLER, RISC

This microcontroller, based on a RISC architecture, offers high performance, efficient instruction execution, and an extensive range of integrated peripherals, making it suitable for various microcontroller applications.

No. of Timers: 5

The presence of five timers allows for precise timekeeping, event scheduling, and PWM generation, enabling the microcontroller to perform a wide range of timing-related functions.

RAM Bytes: 2048

The generous amount of RAM provides ample space for data storage during program execution, enabling efficient processing of data and reducing the need for external memory.

Technology: CMOS

The use of CMOS technology in the microcontroller ensures low power consumption, high noise immunity, and wide voltage compatibility, enhancing its efficiency and reliability.

Terminal Form: GULL WING

The gull wing terminal form facilitates reliable soldering and connection, ensuring stable electrical connections even under challenging conditions.

Analog To Digital Convertors: 12-Ch 12-Bit

The presence of twelve 12-bit analog-to-digital converters enables accurate and precise acquisition of analog signals, expanding the microcontroller's capabilities in data acquisition and sensor interfacing applications.

Maximum Supply Current: 1.62 mA

With a low maximum supply current, this microcontroller ensures energy-efficient operation, making it suitable for battery-powered or energy-constrained applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage specification allows for consistent and reliable operation at the recommended voltage level, ensuring stable performance and reducing the risk of voltage-related issues.

No. of DMA Channels: 3

The inclusion of three DMA channels facilitates efficient data transfer and offloads the CPU, improving the overall system performance and enabling multitasking capabilities.

No. of Serial I/Os: 2

The presence of two serial I/Os allows for communication with external devices using standard serial protocols, expanding the microcontroller's connectivity options.

PWM Channels: YES

The availability of PWM channels enables precise control of analog signals, making it suitable for applications that require motor speed control, LED dimming, or audio signal modulation.

Connectivity: EUSCI(4)

The presence of four Enhanced Universal Serial Communication Interfaces (EUSCI) enables versatile communication capabilities, allowing the microcontroller to interface with a wide range of external devices using various communication protocols.

ROM Programmability: FRAM

The microcontroller's FRAM (Ferroelectric Random Access Memory) programmability allows for fast and reliable non-volatile data storage, enabling easier firmware updates, reducing power consumption, and improving overall system reliability.

Terminal Pitch: 0.5 mm

The microcontroller's small terminal pitch simplifies PCB layout and ensures accurate and reliable connections, allowing for miniaturized designs and facilitating high-density circuitry.

Format: FIXED POINT

The fixed-point format provides efficient representation of numerical data, enabling fast and accurate mathematical calculations, making it suitable for various mathematical and signal processing applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level 3 ensures the microcontroller's resistance to moisture absorption during storage and assembly, reducing the risk of component failure and ensuring long-term reliability.

Speed: 16 rpm

Although not directly applicable to the microcontroller itself, the speed specification indicates the rotational speed of a connected device or motor, making it useful when utilizing the microcontroller in motor control applications.

Low Power Mode: YES

The availability of a low-power mode allows the microcontroller to enter a power-saving state when idle, reducing power consumption and extending battery life, making it ideal for energy-efficient and portable applications.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM enables efficient storage and execution of program code, allowing the microcontroller to handle a wide range of applications while maintaining high performance.

No. of I/O Lines: 63

With 63 I/O lines, this microcontroller offers extensive connectivity options, enabling easy interfacing with various external devices and facilitating versatile input/output configurations.

Technical Specifications

Microcontrollers MSP430FR6879IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

63

No. of Serial I/Os:

2

No. of Terminals:

80

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), LCD, POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR6879IPNR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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