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MSP430FR6877IPZR

Texas Instruments

MSP430FR6877IPZR by Texas Instruments

MSP430FR6877IPZR by Texas Instruments is a 16-bit microcontroller with 83 I/O lines, 16-Ch 12-Bit ADC, and 5 timers. Ideal for industrial applications due to its low power mode, FRAM ROM programmability, and max clock frequency of 24 MHz. Package style: FLATPACK, LOW PROFILE, FINE PITCH.

Median Price

$3.735

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,355 parts In-Stock

1+ parts

$3.735

100+ parts

$3.273

1k+ parts

$1.849

10k+ parts

-

3,355

$3.735

$3.273

$1.849

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,622 parts In-Stock

1+ parts

$3.548

100+ parts

-

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2,622

$3.548

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Vyrian

USA . 8,179 parts In-Stock

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8,179

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Distributors (Availability)

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Corphita

USA . 954 parts In-Stock

1+ parts

$3.362

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-

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954

$3.362

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AZTECH Wire

Italy . 198 parts In-Stock

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$21.690

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198

$21.690

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Parana Technologies

USA . 1,233 parts In-Stock

1+ parts

$32.019

100+ parts

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$94.371

10k+ parts

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1,233

$32.019

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$94.371

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ChromeModa Solutions

Germany . 4,395 parts In-Stock

1+ parts

$35.976

100+ parts

$29.500

1k+ parts

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4,395

$35.976

$29.500

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IDEA Electronic Components Group

UK . 2,099 parts In-Stock

1+ parts

$35.976

100+ parts

$34.177

1k+ parts

$32.378

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2,099

$35.976

$34.177

$32.378

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Component Stockers USA

USA . 5,802 parts In-Stock

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5,802

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DigiPath Technology Company

USA . 230 parts In-Stock

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$32.436

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230

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$32.436

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Overview

Unlock the endless possibilities of the future with the Texas Instruments MSP430FR6877IPZR microcontroller. Designed with cutting-edge technology and precision engineering, this microcontroller offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, the MSP430FR6877IPZR delivers superior functionality and efficiency, making it the ideal choice for your next project. Experience the quality and reliability that only Texas Instruments can provide, and take your innovations to the next level with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it ideal for various applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of devices.

Bit Size: 16

The 16-bit architecture of the microcontroller allows for efficient processing of data and instructions, making it suitable for complex applications.

ADC Channels: YES

The Analog to Digital Converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, expanding its functionality.

No. of Timers: 5

Having multiple timers allows for accurate timing and scheduling of tasks, enhancing the microcontroller's capabilities in time-sensitive applications.

ROM Programmability: FRAM

Ferroelectric Random Access Memory (FRAM) technology offers fast read/write speeds and non-volatility, improving the performance and reliability of the microcontroller.

Connectivity: EUSCI(4)

The EUSCI (Enhanced Universal Synchronous/Asynchronous Communication Interface) offers versatile communication capabilities, enhancing the connectivity of the microcontroller with other devices.

Technical Specifications

Microcontrollers MSP430FR6877IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

83

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), LCD, POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR6877IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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