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MSP430FR6872IRGCR

Texas Instruments

MSP430FR6872IRGCR by Texas Instruments

MSP430FR6872IRGCR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features 8-channel 12-bit ADCs and offers low power modes suitable for industrial applications. With FRAM ROM programmability and various connectivity options like I2C and UART, it's ideal for IoT devices requiring efficient data processing.

Median Price

$3.842

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,950 parts In-Stock

1+ parts

$3.842

100+ parts

$3.132

1k+ parts

$2.088

10k+ parts

-

3,950

$3.842

$3.132

$2.088

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,806 parts In-Stock

1+ parts

$3.650

100+ parts

-

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-

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4,806

$3.650

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Vyrian

USA . 8,883 parts In-Stock

1+ parts

-

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-

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8,883

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,450 parts In-Stock

1+ parts

$3.458

100+ parts

-

1k+ parts

-

10k+ parts

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4,450

$3.458

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-

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AZTECH Wire

Italy . 552 parts In-Stock

1+ parts

$13.930

100+ parts

-

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552

$13.930

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Microchip USA

USA . 4,187 parts In-Stock

1+ parts

$19.001

100+ parts

-

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4,187

$19.001

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Parana Technologies

USA . 550 parts In-Stock

1+ parts

$35.681

100+ parts

-

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550

$35.681

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ChromeModa Solutions

Germany . 1,687 parts In-Stock

1+ parts

$40.091

100+ parts

$32.875

1k+ parts

-

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1,687

$40.091

$32.875

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IDEA Electronic Components Group

UK . 1,568 parts In-Stock

1+ parts

$40.091

100+ parts

$38.086

1k+ parts

$36.082

10k+ parts

-

1,568

$40.091

$38.086

$36.082

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DigiPath Technology Company

USA . 1,418 parts In-Stock

1+ parts

-

100+ parts

$36.146

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-

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1,418

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$36.146

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Overview

Unlock the power of innovation with the MSP430FR6872IRGCR by Texas Instruments. Designed with cutting-edge technology and precision craftsmanship, this microcontroller offers unmatched performance for a wide range of applications. From smart devices to industrial automation, this versatile chip delivers low power consumption and high-speed processing, ensuring seamless operation in any environment. Trust Texas Instruments for top-quality products that redefine what's possible in the world of microcontrollers. Elevate your projects with the MSP430FR6872IRGCR and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components and ensures durability.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

Bit Size: 16

Offers a good balance between performance and cost.

ADC Channels: YES

Enables the microcontroller to interface with analog signals efficiently.

Maximum Clock Frequency: 24 MHz

Provides high processing speed for demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient execution of instructions.

Technical Specifications

Microcontrollers MSP430FR6872IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6872IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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