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MSP430FR68721IRGCR

Texas Instruments

MSP430FR68721IRGCR by Texas Instruments

MSP430FR68721IRGCR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 8-channel 12-bit ADCs, and low power mode. Ideal for industrial applications requiring high-speed processing and connectivity via IRDA, I2C, SPI, and UART interfaces.

Median Price

$3.842

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,950 parts In-Stock

1+ parts

$3.842

100+ parts

$3.132

1k+ parts

$2.088

10k+ parts

-

3,950

$3.842

$3.132

$2.088

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,923 parts In-Stock

1+ parts

$3.650

100+ parts

-

1k+ parts

-

10k+ parts

-

2,923

$3.650

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-

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Vyrian

USA . 7,737 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,737

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,292 parts In-Stock

1+ parts

$3.458

100+ parts

-

1k+ parts

-

10k+ parts

-

3,292

$3.458

-

-

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AZTECH Wire

Italy . 966 parts In-Stock

1+ parts

$8.880

100+ parts

-

1k+ parts

-

10k+ parts

-

966

$8.880

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-

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Microchip USA

USA . 3,637 parts In-Stock

1+ parts

$19.001

100+ parts

-

1k+ parts

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10k+ parts

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3,637

$19.001

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-

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Parana Technologies

USA . 2,102 parts In-Stock

1+ parts

$53.632

100+ parts

-

1k+ parts

-

10k+ parts

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2,102

$53.632

-

-

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DigiPath Technology Company

USA . 1,701 parts In-Stock

1+ parts

$59.056

100+ parts

-

1k+ parts

-

10k+ parts

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1,701

$59.056

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-

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ChromeModa Solutions

Germany . 1,184 parts In-Stock

1+ parts

$60.261

100+ parts

$49.414

1k+ parts

-

10k+ parts

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1,184

$60.261

$49.414

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IDEA Electronic Components Group

UK . 827 parts In-Stock

1+ parts

$60.261

100+ parts

$57.248

1k+ parts

$54.235

10k+ parts

-

827

$60.261

$57.248

$54.235

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Overview

Unlock endless possibilities with the MSP430FR68721IRGCR by Texas Instruments, a cutting-edge microcontroller that guarantees top-notch quality and reliability. Designed to meet the demands of various applications, this chip provides exceptional value and benefits to customers looking for seamless performance and efficiency. With advanced features like FRAM programmability and low power modes, this microcontroller offers unmatched advantages in terms of speed, connectivity, and functionality. Experience innovation at its finest with the MSP430FR68721IRGCR and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of applications.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making this microcontroller suitable for energy-efficient designs.

ROM Words: 65536

Ample ROM capacity for storing program instructions and data, enabling complex applications to be executed smoothly.

Peripherals: BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

A wide range of peripherals available, enhancing the functionality and versatility of the microcontroller for various application needs.

Maximum Clock Frequency: 24 MHz

High clock frequency allows for fast and efficient processing of instructions, improving overall performance of the microcontroller.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple ADC channels with high resolution enable accurate and precise analog to digital conversion, crucial for sensor interfacing and data acquisition.

Connectivity: IRDA, I2C, SPI(2), UART

Various communication interfaces supported, facilitating easy integration with other devices and systems in the network.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance, efficient instruction execution, and reduced power consumption, making it an ideal choice for embedded systems.

Low Power Mode: YES

Low power mode functionality enables energy efficiency, extending battery life and reducing overall power consumption in portable or battery-operated devices.

Technical Specifications

Microcontrollers MSP430FR68721IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR68721IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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