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MSP430FR6820IG56R

Texas Instruments

MSP430FR6820IG56R by Texas Instruments

MSP430FR6820IG56R by Texas Instruments is a 16-bit microcontroller with 52 I/O lines, 8-Ch 12-Bit ADC channels, and FRAM ROM programmability. Ideal for industrial applications, it operates b/w -40 to 85°C with low power mode support and offers various peripherals like RTC, PWM, and DMA for efficient performance.

Median Price

$2.915

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$2.915

100+ parts

$2.376

1k+ parts

$1.584

10k+ parts

-

1,500

$2.915

$2.376

$1.584

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,638 parts In-Stock

1+ parts

$2.769

100+ parts

-

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1,638

$2.769

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Vyrian

USA . 2,685 parts In-Stock

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-

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2,685

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,698 parts In-Stock

1+ parts

$2.624

100+ parts

-

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2,698

$2.624

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AZTECH Wire

Italy . 1,144 parts In-Stock

1+ parts

$12.780

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1,144

$12.780

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Microchip USA

USA . 4,600 parts In-Stock

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$14.414

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4,600

$14.414

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Parana Technologies

USA . 1,391 parts In-Stock

1+ parts

$14.998

100+ parts

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1k+ parts

$15.421

10k+ parts

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1,391

$14.998

-

$15.421

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ChromeModa Solutions

Germany . 5,779 parts In-Stock

1+ parts

$16.852

100+ parts

$13.819

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5,779

$16.852

$13.819

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IDEA Electronic Components Group

UK . 2,047 parts In-Stock

1+ parts

$16.852

100+ parts

$16.009

1k+ parts

$15.167

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2,047

$16.852

$16.009

$15.167

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QUARKTWIN TECHNOLOGY LTD

USA . 20,759 parts In-Stock

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20,759

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Component Stockers USA

USA . 2,612 parts In-Stock

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2,612

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DigiPath Technology Company

USA . 1,521 parts In-Stock

1+ parts

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100+ parts

$15.194

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1,521

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$15.194

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR6820IG56R microcontroller. Built with precision and expertise, this device offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this product delivers unmatched value and efficiency. With cutting-edge technology and top-notch features, the MSP430FR6820IG56R is your go-to solution for all your microcontroller needs. Trust Texas Instruments to provide you with the quality and reliability you deserve. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options, accommodating a wider range of power sources.

Bit Size: 16

16-bit architecture provides more processing power and efficiency compared to lower bit sizes, allowing for complex calculations and tasks to be performed effectively.

ADC Channels: YES

Analog to Digital Converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, expanding its functionality and application capabilities.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller's peripheral IC type ensures efficient and streamlined execution of instructions, enhancing overall performance and responsiveness.

RAM Bytes: 2048

Ample RAM capacity allows for quick and efficient data processing and storage, enabling the microcontroller to handle complex algorithms and multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption, making the microcontroller energy-efficient and suitable for battery-powered or low-power applications.

Connectivity: IRDA, I2C, SPI(2), UART

Multiple connectivity options (IRDA, I2C, SPI, UART) provide versatile communication interfaces, facilitating integration with various devices and systems.

Technical Specifications

Microcontrollers MSP430FR6820IG56R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

52

No. of Terminals:

56

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

IRDA, I2C, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), CRC, DMA(3), LCD, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR6820IG56R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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