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MSP430FR59941IZVWR

Texas Instruments

MSP430FR59941IZVWR by Texas Instruments

MSP430FR59941IZVWR by Texas Instruments is a 16-bit microcontroller with 262144 ROM words and 8192 RAM bytes. It features 22-Ch 12-Bit ADC channels, PWM channels, and connectivity options like I2C(4), IRDA(4), UART(4). Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$7.712

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,586 parts In-Stock

1+ parts

$6.124

100+ parts

$4.992

1k+ parts

$3.328

10k+ parts

-

3,586

$6.124

$4.992

$3.328

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Mouser Electronics

USA . 366 parts In-Stock

1+ parts

$9.300

100+ parts

$7.910

1k+ parts

$6.180

10k+ parts

-

366

$9.300

$7.910

$6.180

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Distributors (In-Stock)

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Digiode

USA . 446 parts In-Stock

1+ parts

$5.818

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-

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446

$5.818

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Vyrian

USA . 5,496 parts In-Stock

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5,496

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Semicontronic

India . 1,885 parts In-Stock

1+ parts

$5.210

100+ parts

$5.080

1k+ parts

$5.054

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1,885

$5.210

$5.080

$5.054

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Ampacity Inc.

Singapore . 1,751 parts In-Stock

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$5.210

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$5.210

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Corphita

USA . 2,785 parts In-Stock

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$5.512

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$5.512

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Microchip USA

USA . 2,420 parts In-Stock

1+ parts

$29.500

100+ parts

$29.310

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$29.220

10k+ parts

$29.130

2,420

$29.500

$29.310

$29.220

$29.130

Parana Technologies

USA . 403 parts In-Stock

1+ parts

$52.655

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403

$52.655

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ChromeModa Solutions

Germany . 1,128 parts In-Stock

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$59.163

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$48.514

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1,128

$59.163

$48.514

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IDEA Electronic Components Group

UK . 459 parts In-Stock

1+ parts

$59.163

100+ parts

$56.205

1k+ parts

$53.247

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459

$59.163

$56.205

$53.247

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$75.302

100+ parts

$71.537

1k+ parts

$71.537

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3,000

$75.302

$71.537

$71.537

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Corohmni

South Africa . 175 parts In-Stock

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$78.225

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$78.225

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Argo Parts USA

USA . 4,865 parts In-Stock

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Continental Prestige Electronics

USA . 4,191 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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DigiPath Technology Company

USA . 574 parts In-Stock

1+ parts

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$53.341

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574

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$53.341

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Experience the power of innovation with the MSP430FR59941IZVWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are perfect for a wide range of applications. With advanced features such as FRAM ROM programmability and 22-channel 12-bit ADC, this microcontroller offers unmatched performance and reliability. Whether you're working on IoT projects, industrial automation, or consumer electronics, the MSP430FR59941IZVWR provides the value, benefits, and advantages you need to bring your ideas to life. Trust Texas Instruments to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and helps in reducing the overall weight of the microcontroller.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, making this microcontroller suitable for mass production applications.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can accommodate a wide range of power sources, increasing its versatility.

Package Shape: SQUARE

The square package shape offers a compact design, maximizing space efficiency on the circuit board.

Bit Size: 16

The 16-bit architecture provides enhanced performance and processing capabilities for demanding applications.

No. of Terminals: 87

The abundance of terminals allows for seamless connectivity with external components, enabling complex system integration.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enhances thermal performance and yields a smaller footprint, ideal for space-constrained designs.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enables energy-efficient operation, making this microcontroller suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, ensuring reliable performance in various applications.

CPU Family: MSP430

Belonging to the MSP430 CPU family, this microcontroller offers a rich set of integrated peripherals and low power consumption, making it a popular choice for embedded systems.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for reliable operation in extreme cold environments, expanding the range of possible applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish with tin/silver/copper ensures excellent conductivity and corrosion resistance, increasing the longevity of the microcontroller.

ADC Channels: YES

The presence of analog-to-digital converter channels enables the microcontroller to interface with sensors and analog signals, enhancing its functionality in data acquisition applications.

DMA Channels: YES

With DMA channels, data transfer between peripherals and memory can be efficiently handled, enhancing overall system performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly, contributing to a more streamlined design process.

ROM Words: 262144

With a large ROM capacity of 262144 words, this microcontroller can store extensive program code and data, accommodating complex applications.

Maximum Seated Height: 1 mm

The low seated height facilitates compact and slim product designs, making this microcontroller suitable for space-constrained applications.

Width: 6 mm

The compact width of 6mm allows for a smaller footprint on the PCB, optimizing space utilization in electronic devices.

Peripherals: BOR, COMPARATOR(16), DMA(6), POR, RTC, TIMER(6), WDT

The array of integrated peripherals offers diverse functionality for interfacing with external devices and optimizing system performance.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency of 24 MHz enables fast processing speeds, making this microcontroller suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The generous reflow time at peak temperature ensures proper soldering of the microcontroller during assembly, reducing the risk of solder defects.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this microcontroller can undergo lead-free soldering processes, meeting modern environmental standards.

Length: 6 mm

The compact length of 6mm contributes to a space-saving design, suitable for applications where board space is limited.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments, making this microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it offers efficient and streamlined processing, ideal for applications requiring high computational performance.

RAM Bytes: 8192

The ample RAM capacity of 8192 bytes allows for efficient data processing and storage, enhancing the performance of the microcontroller.

Technology: CMOS

The CMOS technology utilized in this microcontroller offers low power consumption, suitable for energy-efficient applications.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and enhances electrical connections, ensuring robust performance of the microcontroller.

Analog To Digital Convertors: 22-Ch 12-Bit

The presence of 22 analog-to-digital converters with 12-bit resolution enables accurate and precise conversion of analog signals, enhancing the microcontroller's capability in data acquisition applications.

Nominal Supply Voltage: 3 V

With a nominal supply voltage of 3V, this microcontroller can operate efficiently within a common voltage range, simplifying power management in various applications.

PWM Channels: YES

The availability of pulse-width modulation channels allows for precise control of digital signals, essential for applications like motor control and power management.

Connectivity: I2C(4), IRDA(4), UART(4)

The multiple connectivity options, including I2C, IRDA, and UART, enable flexible communication with external devices, enhancing the versatility of the microcontroller.

ROM Programmability: FRAM

The use of FRAM for ROM programmability offers fast and non-volatile data storage, improving the efficiency and reliability of the microcontroller.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting on the PCB, optimizing space utilization and supporting compact designs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates a moderate level of moisture sensitivity, allowing for safe handling and storage of the microcontroller under controlled environmental conditions.

Speed: 16 rpm

The speed of 16 rotations per minute is not relevant for a microcontroller, as it pertains to rotating machinery.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM provides sufficient storage capacity for program code, supporting a wide range of applications.

No. of I/O Lines: 68

The abundant number of I/O lines allows for versatile connectivity with external devices, facilitating the implementation of various input/output functions in the system.

Technical Specifications

Microcontrollers MSP430FR59941IZVWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B87

JESD-609 Code:

e1

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

68

No. of Terminals:

87

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

262144

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(4), IRDA(4), UART(4)

Peripherals:

BOR, COMPARATOR(16), DMA(6), POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

22-Ch 12-Bit

Trade Compliance

MSP430FR59941IZVWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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