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MSP430FR59891IPMR

Texas Instruments

MSP430FR59891IPMR by Texas Instruments

MSP430FR59891IPMR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 48 I/O lines, and 24 MHz clock frequency. Ideal for industrial applications requiring ADC and PWM channels, DMA support, and operating temperatures from -40 to 85°C. Package style: flatpack, low profile, fine pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,106 parts In-Stock

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Digiode

USA . 2,162 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Semicontronic

India . 1,145 parts In-Stock

1+ parts

$4.000

100+ parts

$3.900

1k+ parts

$3.880

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-

1,145

$4.000

$3.900

$3.880

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Ampacity Inc.

Singapore . 862 parts In-Stock

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$11.000

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862

$11.000

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AZTECH Wire

Italy . 894 parts In-Stock

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$19.178

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894

$19.178

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Parana Technologies

USA . 2,322 parts In-Stock

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$20.279

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$20.279

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2,322

$20.279

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$20.279

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DigiPath Technology Company

USA . 2,132 parts In-Stock

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$22.329

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2,132

$22.329

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ChromeModa Solutions

Germany . 1,146 parts In-Stock

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$22.785

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$18.684

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$22.785

$18.684

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IDEA Electronic Components Group

UK . 870 parts In-Stock

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$22.785

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$21.646

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$20.506

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870

$22.785

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$20.506

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Microchip USA

USA . 463 parts In-Stock

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$25.900

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$25.740

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$25.660

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$25.580

463

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$25.580

One Stop Electronics

USA . 1,077 parts In-Stock

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$33.000

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1,077

$33.000

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Corohmni

South Africa . 93 parts In-Stock

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$61.213

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93

$61.213

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$62.797

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$59.657

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$59.657

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5,000

$62.797

$59.657

$59.657

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Continental Prestige Electronics

USA . 5,506 parts In-Stock

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Corphita

USA . 4,808 parts In-Stock

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Argo Parts USA

USA . 2,074 parts In-Stock

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Bastille Electronics

Australia . 18 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR59891IPMR microcontroller. Designed with cutting-edge technology and precision engineering, this device offers unmatched performance for a wide range of applications. From smart home devices to wearable technology, this versatile microcontroller provides reliability, efficiency, and flexibility that customers can trust. Experience seamless integration, high-speed processing, and low power consumption, all in a compact package. Elevate your projects with the MSP430FR59891IPMR and revolutionize the way you create.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage - 3.6 V

Allows for a wide operating voltage range, making it versatile for various applications.

Bit Size - 16

With a 16-bit architecture, this microcontroller can handle more complex tasks and calculations efficiently.

Maximum Operating Temperature - 85 °C

Can operate in high-temperature environments without risk of damage, enhancing reliability.

ROM Words - 131072

Having a large ROM capacity allows for storing extensive program code and data, making it suitable for advanced applications.

Maximum Clock Frequency - 24 MHz

Operates at a high clock frequency, enabling fast processing and response times.

Peripheral IC Type - MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing (RISC) architecture for efficient and streamlined operations.

Technical Specifications

Microcontrollers MSP430FR59891IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSP430FR59891IPMR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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