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MSP430FR5988IPMR

Texas Instruments

MSP430FR5988IPMR by Texas Instruments

MSP430FR5988IPMR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at a max frequency of 24 MHz. It features ADC and DMA channels, ROM programmability via flash, and PWM channels for industrial applications requiring high-speed processing in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,928 parts In-Stock

1+ parts

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4,928

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Digiode

USA . 4,330 parts In-Stock

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4,330

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,125 parts In-Stock

1+ parts

$12.000

100+ parts

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1,125

$12.000

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One Stop Electronics

USA . 1,514 parts In-Stock

1+ parts

$14.000

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1,514

$14.000

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AZTECH Wire

Italy . 385 parts In-Stock

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$18.052

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385

$18.052

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Microchip USA

USA . 485 parts In-Stock

1+ parts

$25.270

100+ parts

$25.110

1k+ parts

$25.030

10k+ parts

$24.960

485

$25.270

$25.110

$25.030

$24.960

Parana Technologies

USA . 97 parts In-Stock

1+ parts

$68.873

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97

$68.873

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DigiPath Technology Company

USA . 1,070 parts In-Stock

1+ parts

$75.837

100+ parts

$69.770

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1,070

$75.837

$69.770

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IDEA Electronic Components Group

UK . 1,365 parts In-Stock

1+ parts

$77.385

100+ parts

$73.516

1k+ parts

$69.646

10k+ parts

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1,365

$77.385

$73.516

$69.646

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ChromeModa Solutions

Germany . 491 parts In-Stock

1+ parts

$77.385

100+ parts

$63.456

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491

$77.385

$63.456

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Corphita

USA . 4,061 parts In-Stock

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4,061

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Overview

Discover the unparalleled performance and reliability of the Texas Instruments MSP430FR5988IPMR microcontroller, designed to exceed your expectations in a wide range of applications. From industrial automation to consumer electronics, this innovative device offers exceptional value with its advanced features and cutting-edge technology. Trust in Texas Instruments' legacy of excellence and elevate your projects with the MSP430FR5988IPMR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and is resistant to impact, making the product suitable for a variety of industrial applications.

Surface Mount: YES

Surface mount technology allows for more efficient and compact designs, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A high maximum supply voltage tolerance provides flexibility and robustness in different operating conditions.

ADC Channels: YES

The presence of Analog-to-Digital converter channels enables the product to interface with analog sensors and inputs, expanding its functionality.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization, enhancing the product's versatility and adaptability.

Technical Specifications

Microcontrollers MSP430FR5988IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSP430FR5988IPMR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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