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MSP430FR5959IDA

Texas Instruments

MSP430FR5959IDA by Texas Instruments

MSP430FR5959IDA by Texas Instruments is a 16-bit microcontroller with 65536 ROM words and 2048 RAM bytes. Featuring 12-Ch 12-Bit ADC channels, it offers low power mode and operates at a max clock frequency of 24 MHz. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$6.480

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,906 parts In-Stock

1+ parts

$4.372

100+ parts

$3.564

1k+ parts

$2.376

10k+ parts

-

11,906

$4.372

$3.564

$2.376

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Mouser Electronics

USA . 101 parts In-Stock

1+ parts

$6.480

100+ parts

-

1k+ parts

$4.240

10k+ parts

-

101

$6.480

-

$4.240

-

DigiKey

USA . 25 parts In-Stock

1+ parts

$6.480

100+ parts

-

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-

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25

$6.480

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-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.493

100+ parts

-

1k+ parts

-

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100

$3.493

-

-

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Digiode

USA . 2,690 parts In-Stock

1+ parts

$4.153

100+ parts

-

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2,690

$4.153

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-

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Vyrian

USA . 2,162 parts In-Stock

1+ parts

-

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2,162

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,135 parts In-Stock

1+ parts

$3.493

100+ parts

-

1k+ parts

-

10k+ parts

$3.423

3,135

$3.493

-

-

$3.423

Argo Parts USA

USA . 2,020 parts In-Stock

1+ parts

$3.493

100+ parts

-

1k+ parts

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10k+ parts

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2,020

$3.493

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-

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Ampacity Inc.

Singapore . 3,728 parts In-Stock

1+ parts

$3.720

100+ parts

-

1k+ parts

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10k+ parts

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3,728

$3.720

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-

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Corphita

USA . 160 parts In-Stock

1+ parts

$3.935

100+ parts

-

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160

$3.935

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Parana Technologies

USA . 674 parts In-Stock

1+ parts

$67.028

100+ parts

-

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674

$67.028

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DigiPath Technology Company

USA . 1,570 parts In-Stock

1+ parts

$73.806

100+ parts

$67.901

1k+ parts

-

10k+ parts

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1,570

$73.806

$67.901

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ChromeModa Solutions

Germany . 3,138 parts In-Stock

1+ parts

$75.312

100+ parts

$61.756

1k+ parts

-

10k+ parts

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3,138

$75.312

$61.756

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IDEA Electronic Components Group

UK . 871 parts In-Stock

1+ parts

$75.312

100+ parts

$71.546

1k+ parts

$67.781

10k+ parts

-

871

$75.312

$71.546

$67.781

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Lixinc

USA . 17,209 parts In-Stock

1+ parts

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17,209

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Overview

Unlock the potential of your projects with the MSP430FR5959IDA by Texas Instruments, a top-of-the-line microcontroller that boasts unparalleled quality and reliability. From industrial applications to IoT devices, this small yet powerful device offers customers a wide range of benefits, including low power consumption, high-speed performance, and a variety of peripherals for seamless integration. Trust in Texas Instruments' reputation for excellence and choose the MSP430FR5959IDA for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Helps in reducing overall weight of the product and provides good insulation for electronic components.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltage, making the product versatile and compatible with different power sources.

Bit Size: 16

Provides high computational capabilities and allows for handling complex tasks efficiently.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures, making it suitable for a variety of environments.

ADC Channels: YES

Enables analog to digital conversion, essential for interfacing with sensors and other analog devices.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and reduce CPU overhead.

ROM Words: 65536

Provides a large amount of read-only memory for storing program instructions and data.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and speedy execution of instructions, making the microcontroller performance-oriented.

Nominal Supply Voltage: 3 V

Stable and common supply voltage ensures compatibility with various power sources.

Speed: 16 rpm

Moderate clock speed suitable for a wide range of applications without sacrificing power efficiency.

Technical Specifications

Microcontrollers MSP430FR5959IDA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Connectivity:

EUSCI(3)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR5959IDA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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