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MSP430FR5957IRHAR

Texas Instruments

MSP430FR5957IRHAR by Texas Instruments

MSP430FR5957IRHAR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 32768 ROM words. It features 14-Ch 12-Bit ADC channels, 3 DMA channels, and PWM capabilities. Ideal for industrial applications requiring low power consumption and high-speed processing up to 24 MHz.

Median Price

$2.782

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,875 parts In-Stock

1+ parts

$2.782

100+ parts

$2.268

1k+ parts

$1.512

10k+ parts

-

5,875

$2.782

$2.268

$1.512

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,420 parts In-Stock

1+ parts

$2.643

100+ parts

-

1k+ parts

-

10k+ parts

-

3,420

$2.643

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-

-

Vyrian

USA . 8,455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,455

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 658 parts In-Stock

1+ parts

$2.504

100+ parts

-

1k+ parts

-

10k+ parts

-

658

$2.504

-

-

-

Microchip USA

USA . 1,897 parts In-Stock

1+ parts

$13.200

100+ parts

$13.120

1k+ parts

$13.080

10k+ parts

$13.040

1,897

$13.200

$13.120

$13.080

$13.040

AZTECH Wire

Italy . 1,067 parts In-Stock

1+ parts

$14.130

100+ parts

-

1k+ parts

-

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1,067

$14.130

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-

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Parana Technologies

USA . 1,409 parts In-Stock

1+ parts

$35.392

100+ parts

-

1k+ parts

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10k+ parts

-

1,409

$35.392

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-

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DigiPath Technology Company

USA . 2,364 parts In-Stock

1+ parts

$38.971

100+ parts

$35.853

1k+ parts

-

10k+ parts

-

2,364

$38.971

$35.853

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ChromeModa Solutions

Germany . 321 parts In-Stock

1+ parts

$39.766

100+ parts

$32.608

1k+ parts

-

10k+ parts

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321

$39.766

$32.608

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IDEA Electronic Components Group

UK . 42 parts In-Stock

1+ parts

$39.766

100+ parts

$37.778

1k+ parts

$35.789

10k+ parts

-

42

$39.766

$37.778

$35.789

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Overview

Unlock a world of possibilities with the Texas Instruments MSP430FR5957IRHAR microcontroller, delivering unparalleled quality and reliability. As a leader in the industry, Texas Instruments ensures top-notch performance and innovation in every product. Ideal for a range of applications, this microcontroller offers customers exceptional value, benefits, and advantages. Experience seamless connectivity, advanced features, and low power consumption with the MSP430FR5957IRHAR, making it the perfect choice for your next project. Elevate your designs with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Maximum Supply Voltage: 3.6 V

Offers flexibility in power supply options and compatibility with a wide range of systems.

ADC Channels: YES

The built-in Analog to Digital Converters increase the versatility of the microcontroller in capturing external analog signals.

DMA Channels: YES

Direct Memory Access channels can improve data transfer speeds and efficiency in handling data-intensive tasks.

Maximum Clock Frequency: 24 MHz

Higher clock frequency allows for faster processing speeds and overall performance of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

The Reduced Instruction Set Computing architecture provides efficient processing capabilities, ideal for embedded systems.

RAM Bytes: 1024

Sufficient Random Access Memory for storing and accessing data during operation, ensuring smooth performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Analog To Digital Convertors: 14-Ch 12-Bit

Multiple ADC channels with high resolution enable accurate conversion of analog signals to digital data, suitable for precision measurement applications.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of analog devices or motors, enhancing the microcontroller's capability in motor control and power management.

Technical Specifications

Microcontrollers MSP430FR5957IRHAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Connectivity:

EUSCI(3)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

14-Ch 12-Bit

Trade Compliance

MSP430FR5957IRHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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