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MSP430FR5948IRHAR

Texas Instruments

MSP430FR5948IRHAR by Texas Instruments

MSP430FR5948IRHAR by Texas Instruments is a 16-bit microcontroller with 14-Ch 12-Bit ADC channels, 3 DMA channels, and 5 timers. It operates at a max clock frequency of 24 MHz and has low power mode capabilities. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$3.400

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,462 parts In-Stock

1+ parts

$3.400

100+ parts

$2.772

1k+ parts

$1.848

10k+ parts

-

13,462

$3.400

$2.772

$1.848

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,013 parts In-Stock

1+ parts

$3.230

100+ parts

-

1k+ parts

-

10k+ parts

-

1,013

$3.230

-

-

-

Vyrian

USA . 7,282 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,282

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,284 parts In-Stock

1+ parts

$3.060

100+ parts

-

1k+ parts

-

10k+ parts

-

4,284

$3.060

-

-

-

AZTECH Wire

Italy . 585 parts In-Stock

1+ parts

$10.240

100+ parts

-

1k+ parts

-

10k+ parts

-

585

$10.240

-

-

-

Microchip USA

USA . 1,817 parts In-Stock

1+ parts

$16.140

100+ parts

$16.040

1k+ parts

$15.990

10k+ parts

$15.940

1,817

$16.140

$16.040

$15.990

$15.940

Parana Technologies

USA . 928 parts In-Stock

1+ parts

$47.407

100+ parts

$4,402.435

1k+ parts

$42.666

10k+ parts

-

928

$47.407

$4,402.435

$42.666

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DigiPath Technology Company

USA . 1,907 parts In-Stock

1+ parts

$52.201

100+ parts

-

1k+ parts

-

10k+ parts

-

1,907

$52.201

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-

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ChromeModa Solutions

Germany . 1,623 parts In-Stock

1+ parts

$53.266

100+ parts

$43.678

1k+ parts

-

10k+ parts

-

1,623

$53.266

$43.678

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IDEA Electronic Components Group

UK . 57 parts In-Stock

1+ parts

$53.266

100+ parts

$50.603

1k+ parts

$47.939

10k+ parts

-

57

$53.266

$50.603

$47.939

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Overview

Discover the cutting-edge technology of the MSP430FR5948IRHAR by Texas Instruments, a top-tier microcontroller that offers exceptional performance and reliability. Designed with high-quality materials and advanced features, this product is perfect for a wide range of applications in various industries. Experience the seamless integration and efficiency of this microcontroller, which provides customers with unparalleled value, benefits, and advantages. Upgrade your projects with the MSP430FR5948IRHAR and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for greater flexibility in power supply options and compatibility with various systems.

No. of Terminals: 40

Higher number of terminals provide more connectivity options and flexibility in designing and integrating the microcontroller into a system.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the microcontroller to operate in extreme conditions, making it suitable for industrial applications.

ADC Channels: YES

Analog to Digital Converters enable the microcontroller to interface with analog sensors and signals, enhancing its versatility in data acquisition applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables high performance and efficiency in processing tasks, making the microcontroller suitable for a wide range of applications.

ROM Programmability: FRAM

FRAM technology offers fast and reliable non-volatile memory storage, enhancing the performance and reliability of the microcontroller.

Technical Specifications

Microcontrollers MSP430FR5948IRHAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

49152

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Connectivity:

EUSCI(3)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

14-Ch 12-Bit

Trade Compliance

MSP430FR5948IRHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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