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MSP430FR59471IRHAR

Texas Instruments

MSP430FR59471IRHAR by Texas Instruments

MSP430FR59471IRHAR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 32768 ROM words. It features 14-Ch 12-Bit ADC channels, 3 DMA channels, and PWM support. Ideal for industrial applications requiring low power consumption and high-speed processing up to 24 MHz.

Median Price

$2.782

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,787 parts In-Stock

1+ parts

$2.782

100+ parts

$2.268

1k+ parts

$1.512

10k+ parts

-

7,787

$2.782

$2.268

$1.512

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 74 parts In-Stock

1+ parts

$2.643

100+ parts

-

1k+ parts

-

10k+ parts

-

74

$2.643

-

-

-

Chip Stock

USA . 5,500 parts In-Stock

1+ parts

-

100+ parts

-

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5,500

-

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Vyrian

USA . 2,043 parts In-Stock

1+ parts

-

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2,043

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,375 parts In-Stock

1+ parts

$2.504

100+ parts

-

1k+ parts

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2,375

$2.504

-

-

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Microchip USA

USA . 2,759 parts In-Stock

1+ parts

$13.200

100+ parts

$13.120

1k+ parts

$13.080

10k+ parts

$13.040

2,759

$13.200

$13.120

$13.080

$13.040

AZTECH Wire

Italy . 970 parts In-Stock

1+ parts

$17.250

100+ parts

-

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970

$17.250

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-

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Parana Technologies

USA . 2,071 parts In-Stock

1+ parts

$25.999

100+ parts

$2,414.372

1k+ parts

$23.399

10k+ parts

-

2,071

$25.999

$2,414.372

$23.399

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DigiPath Technology Company

USA . 349 parts In-Stock

1+ parts

$28.628

100+ parts

-

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-

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349

$28.628

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IDEA Electronic Components Group

UK . 1,393 parts In-Stock

1+ parts

$29.212

100+ parts

$27.751

1k+ parts

$26.291

10k+ parts

-

1,393

$29.212

$27.751

$26.291

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ChromeModa Solutions

Germany . 294 parts In-Stock

1+ parts

$29.212

100+ parts

$23.954

1k+ parts

-

10k+ parts

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294

$29.212

$23.954

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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Overview

Discover the innovative MSP430FR59471IRHAR by Texas Instruments, a high-quality microcontroller that offers unmatched value and benefits to customers. With Texas Instruments' reputation for excellence in manufacturing, this versatile product is ideal for a wide range of applications. From low power consumption to exceptional performance, this microcontroller provides advanced features such as ADC channels, PWM channels, and on-chip FRAM programmability. Dive into the world of cutting-edge technology with the MSP430FR59471IRHAR and experience the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the package, ensuring the safety of the microcontroller during operation.

Surface Mount: YES

Surface mount capability allows for easy and convenient mounting on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a wide range of voltage requirements in various applications.

No. of Terminals: 40

Having 40 terminals offers extensive connectivity options, enabling the microcontroller to interface with multiple external devices and peripherals.

Minimum Operating Temperature: -40 °C

Works efficiently in extreme low-temperature environments, making it suitable for applications in harsh climates or industries.

ADC Channels: YES

Integration of Analog to Digital Converter channels allows for accurate conversion of analog signals to digital data, essential for sensing and control applications.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency and reduce CPU workload, improving overall system performance.

ROM Words: 32768

With 32768 ROM words, the microcontroller can store a large amount of program instructions, facilitating complex and feature-rich applications.

No. of Timers: 5

Presence of 5 timers enables precise timing and scheduling of tasks, critical for applications requiring periodic or time-dependent operations.

RAM Bytes: 1024

Having 1024 bytes of RAM allows for efficient data storage and manipulation, supporting multi-tasking and data-intensive applications.

Technical Specifications

Microcontrollers MSP430FR59471IRHAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Connectivity:

EUSCI(3)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

14-Ch 12-Bit

Trade Compliance

MSP430FR59471IRHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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