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MSP430FR5889IPM

Texas Instruments

MSP430FR5889IPM by Texas Instruments

MSP430FR5889IPM by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 2048 RAM bytes. It operates at a max frequency of 24 MHz, suitable for industrial applications requiring low power consumption. Features include 12-Ch 12-Bit ADC channels, 3 DMA channels, and EUSCI connectivity for versatile peripheral interfacing.

Median Price

$8.899

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,334 parts In-Stock

1+ parts

$7.128

100+ parts

$5.811

1k+ parts

$3.874

10k+ parts

-

6,334

$7.128

$5.811

$3.874

-

Mouser Electronics

USA . 46 parts In-Stock

1+ parts

$10.670

100+ parts

$5.730

1k+ parts

$5.400

10k+ parts

$5.300

46

$10.670

$5.730

$5.400

$5.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 474 parts In-Stock

1+ parts

$6.772

100+ parts

-

1k+ parts

-

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474

$6.772

-

-

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Vyrian

USA . 5,308 parts In-Stock

1+ parts

-

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-

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5,308

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

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10

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Distributors (Availability)

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Semicontronic

India . 2,993 parts In-Stock

1+ parts

$6.060

100+ parts

$5.908

1k+ parts

$5.878

10k+ parts

-

2,993

$6.060

$5.908

$5.878

-

Corphita

USA . 4,939 parts In-Stock

1+ parts

$6.415

100+ parts

-

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4,939

$6.415

-

-

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Ampacity Inc.

Singapore . 3,173 parts In-Stock

1+ parts

$13.190

100+ parts

-

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-

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-

3,173

$13.190

-

-

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Microchip USA

USA . 2,016 parts In-Stock

1+ parts

$30.660

100+ parts

$30.220

1k+ parts

$30.000

10k+ parts

$29.780

2,016

$30.660

$30.220

$30.000

$29.780

Parana Technologies

USA . 1,591 parts In-Stock

1+ parts

$31.843

100+ parts

-

1k+ parts

$90.370

10k+ parts

-

1,591

$31.843

-

$90.370

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DigiPath Technology Company

USA . 1,513 parts In-Stock

1+ parts

$35.063

100+ parts

-

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-

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1,513

$35.063

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ChromeModa Solutions

Germany . 1,721 parts In-Stock

1+ parts

$35.779

100+ parts

$29.339

1k+ parts

-

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1,721

$35.779

$29.339

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IDEA Electronic Components Group

UK . 40 parts In-Stock

1+ parts

$35.779

100+ parts

$33.990

1k+ parts

$32.201

10k+ parts

-

40

$35.779

$33.990

$32.201

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Corohmni

South Africa . 193 parts In-Stock

1+ parts

$38.528

100+ parts

-

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193

$38.528

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$76.265

100+ parts

$72.452

1k+ parts

$72.452

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-

5,000

$76.265

$72.452

$72.452

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Argo Parts USA

USA . 4,753 parts In-Stock

1+ parts

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4,753

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Continental Prestige Electronics

USA . 3,617 parts In-Stock

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3,617

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iodParts Technologies Inc.

India . 880 parts In-Stock

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880

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Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

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200

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Overview

Experience the cutting-edge performance of the Texas Instruments MSP430FR5889IPM microcontroller. With its advanced features and high-quality manufacturing, this device is perfect for a wide range of applications. From industrial automation to consumer electronics, the MSP430FR5889IPM offers unparalleled value and benefits to customers. Its low power mode and integrated cache ensure efficient operation, while its flexibility and reliability make it a top choice for any project. Trust Texas Instruments to deliver the quality and innovation you need to bring your designs to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product long-lasting and affordable.

Integrated Cache: YES

Having an integrated cache improves the performance and speed of the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, providing flexibility in power requirements.

Package Shape: SQUARE

The square shape simplifies the mounting process and saves space on the board.

No. of Terminals: 64

With 64 terminals, this microcontroller offers a wide range of connectivity options.

Minimum Operating Temperature: -40 °C

Can operate in very low temperatures, making it suitable for various environments.

ADC Channels: YES

Having ADC channels allows for analog-to-digital conversion, enabling the microcontroller to process analog signals.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures efficient processing and execution of instructions.

RAM Bytes: 2048

With 2048 bytes of RAM, the microcontroller can handle a large amount of data efficiently.

Maximum Clock Frequency: 24 MHz

Operating at a high clock frequency enables fast execution of tasks and operations.

Technical Specifications

Microcontrollers MSP430FR5889IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR5889IPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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