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MSP430FR58891IRGCR

Texas Instruments

MSP430FR58891IRGCR by Texas Instruments

MSP430FR58891IRGCR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 2048 RAM bytes, and 12-Ch 12-Bit ADC channels. Ideal for industrial applications, it offers up to 24 MHz clock frequency, FRAM ROM programmability, and various peripherals like BOR, RTC, and WDT.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,402 parts In-Stock

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Vyrian

USA . 2,636 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Ampacity Inc.

Singapore . 543 parts In-Stock

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$10.000

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543

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Parana Technologies

USA . 1,353 parts In-Stock

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$14.753

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$15.193

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AZTECH Wire

Italy . 734 parts In-Stock

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$16.071

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ChromeModa Solutions

Germany . 6,023 parts In-Stock

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$16.576

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$13.592

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IDEA Electronic Components Group

UK . 318 parts In-Stock

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$16.576

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$15.747

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$14.918

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318

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One Stop Electronics

USA . 1,035 parts In-Stock

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$17.000

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Semicontronic

India . 845 parts In-Stock

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$33.000

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$32.175

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$32.010

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Corohmni

South Africa . 411 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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Continental Prestige Electronics

USA . 3,250 parts In-Stock

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Corphita

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Argo Parts USA

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DigiPath Technology Company

USA . 1,785 parts In-Stock

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$14.945

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Microchip USA

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR58891IRGCR microcontroller. Built with precision and expertise, this cutting-edge device offers unmatched reliability and performance for a wide range of applications. Whether you're designing IoT devices, wearable technology, or industrial equipment, this microcontroller delivers exceptional value, efficiency, and flexibility. Trust Texas Instruments to provide the quality and advantages you need to bring your ideas to life. Elevate your projects with the MSP430FR58891IRGCR and experience a new level of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, reducing production time and cost.

Maximum Supply Voltage: 3.6 V

Supports higher voltage inputs, providing flexibility in power supply options.

Bit Size: 16

16-bit architecture allows for higher computational capabilities and efficient processing of data.

No. of Terminals: 64

With 64 terminals, this microcontroller can interface with a wide range of external devices and components.

Minimum Supply Voltage: 1.8 V

Can operate at low supply voltages, making it suitable for power-sensitive applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, enabling use in industrial and harsh environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable operation in extreme cold conditions.

ADC Channels: YES

Integrated Analog to Digital Converters allow for precise measurement and conversion of analog signals.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU overhead.

ROM Words: 131072

Large ROM capacity allows for storing a significant amount of program data and instructions.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast data processing and real-time operation.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction execution and high performance.

RAM Bytes: 2048

Sufficient RAM capacity for data storage and manipulation during operation.

Analog To Digital Convertors: 12-Ch 12-Bit

12-channel 12-bit ADC provides accurate and high-resolution analog signal conversion.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation.

Nominal Supply Voltage: 3 V

Nominal supply voltage simplifies power supply design and compatibility.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of digital signals and power levels.

Connectivity: EUSCI(4)

Enhanced Universal Serial Communication Interface supports versatile connectivity options.

ROM Programmability: FRAM

FRAM technology offers fast and non-volatile program memory with high endurance.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating ensures reliable performance even in moderate humidity conditions.

Technical Specifications

Microcontrollers MSP430FR58891IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR58891IRGCR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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