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MSP430FR58891IPMR

Texas Instruments

MSP430FR58891IPMR by Texas Instruments

MSP430FR58891IPMR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 2048 RAM bytes, and 12-Ch 12-Bit ADC channels. It operates at a max clock frequency of 24 MHz and features peripherals like BOR, RTC, and WDT. Ideal for industrial applications requiring low power consumption and high performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,836 parts In-Stock

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Digiode

USA . 1,336 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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One Stop Electronics

USA . 211 parts In-Stock

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$3.000

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211

$3.000

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Semicontronic

India . 1,325 parts In-Stock

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$10.000

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$9.750

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$9.700

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AZTECH Wire

Italy . 784 parts In-Stock

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$15.054

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Ampacity Inc.

Singapore . 288 parts In-Stock

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$16.000

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$16.000

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Microchip USA

USA . 415 parts In-Stock

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$25.510

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$25.350

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$25.270

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$25.190

415

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$25.190

Corohmni

South Africa . 147 parts In-Stock

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$40.466

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$57.555

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$54.678

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$54.678

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Parana Technologies

USA . 1,251 parts In-Stock

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$63.790

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ChromeModa Solutions

Germany . 2,195 parts In-Stock

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$71.674

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$58.773

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IDEA Electronic Components Group

UK . 1,238 parts In-Stock

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$71.674

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$68.090

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$64.507

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Corphita

USA . 4,820 parts In-Stock

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DigiPath Technology Company

USA . 1,342 parts In-Stock

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Argo Parts USA

USA . 1,026 parts In-Stock

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Continental Prestige Electronics

USA . 941 parts In-Stock

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Bastille Electronics

Australia . 23 parts In-Stock

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Overview

Experience the cutting-edge technology of the MSP430FR58891IPMR by Texas Instruments, a top-tier manufacturer known for its high-quality microcontrollers. Ideal for a wide range of applications, this product offers unparalleled value with its advanced features and benefits. With its innovative design, low power consumption, and versatile peripherals, customers can expect superior performance and reliability. Upgrade your projects with the MSP430FR58891IPMR and unlock endless possibilities in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and long-lasting use.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

Bit Size: 16

Provides sufficient processing power for various applications.

ROM Words: 131072

Large memory capacity for storing program instructions and data.

Maximum Clock Frequency: 24 MHz

High clock frequency for efficient processing speed.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Analog To Digital Convertors: 12-Ch 12-Bit

Multiple ADC channels with high resolution for accurate analog signal conversion.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for streamlined and efficient instruction execution.

RAM Bytes: 2048

Adequate RAM for data storage and manipulation.

PWM Channels: YES

Support for PWM channels for precise control of connected devices.

Technical Specifications

Microcontrollers MSP430FR58891IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR58891IPMR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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