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MSP430FR5888IPMR

Texas Instruments

MSP430FR5888IPMR by Texas Instruments

MSP430FR5888IPMR by Texas Instruments is a 16-bit microcontroller with 64 terminals, 2048 bytes of RAM, and 12-channel 12-bit ADC. It operates at a max frequency of 24 MHz and features FRAM ROM programmability. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,597 parts In-Stock

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Digiode

USA . 1,761 parts In-Stock

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1,761

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One Stop Electronics

USA . 377 parts In-Stock

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$2.000

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377

$2.000

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AZTECH Wire

Italy . 225 parts In-Stock

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$11.462

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$11.462

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Parana Technologies

USA . 49 parts In-Stock

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$54.796

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$5,088.595

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$49.316

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49

$54.796

$5,088.595

$49.316

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DigiPath Technology Company

USA . 1,527 parts In-Stock

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$60.337

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IDEA Electronic Components Group

UK . 1,878 parts In-Stock

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$61.568

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$58.490

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$55.411

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1,878

$61.568

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ChromeModa Solutions

Germany . 1,832 parts In-Stock

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$61.568

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$50.486

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QUARKTWIN TECHNOLOGY LTD

USA . 20,196 parts In-Stock

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Microchip USA

USA . 4,701 parts In-Stock

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Corphita

USA . 1,755 parts In-Stock

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Overview

Unleash the power of innovation with the MSP430FR5888IPMR by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers exceptional quality and reliability in every product. The MSP430FR5888IPMR is designed to revolutionize your projects with its versatile applications in various industries. With advanced features such as ADC channels, DMA channels, and ROM programmability, this microcontroller offers unmatched value and benefits to customers. Experience seamless connectivity, superior performance, and endless possibilities with the MSP430FR5888IPMR. Elevate your designs and stay ahead of the competition with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to damage, increasing the reliability of the product.

Maximum Clock Frequency: 24 MHz

High clock frequency allows for fast processing and efficient operation of the microcontroller.

RAM Bytes: 2048

Ample RAM capacity allows for efficient data storage and processing, making the microcontroller suitable for a wide range of applications.

Analog To Digital Convertors: 12-Ch 12-Bit

The presence of 12 analog to digital converters with 12-bit resolution allows for accurate and precise conversion of analog signals into digital data.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and power efficiency, making it suitable for various embedded systems applications where real-time processing is required.

Technical Specifications

Microcontrollers MSP430FR5888IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

98304

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR5888IPMR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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