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MSP430FR5887IPMR

Texas Instruments

MSP430FR5887IPMR by Texas Instruments

MSP430FR5887IPMR by Texas Instruments is a 16-bit microcontroller with 64 terminals, 24 MHz clock frequency, and FRAM ROM. Ideal for industrial applications, it features low power mode, 12-Ch ADCs, and 3 DMA channels for efficient data processing in compact designs.

Median Price

$5.010

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,500 parts In-Stock

1+ parts

$5.010

100+ parts

$4.085

1k+ parts

$2.723

10k+ parts

-

8,500

$5.010

$4.085

$2.723

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,719 parts In-Stock

1+ parts

$4.760

100+ parts

-

1k+ parts

-

10k+ parts

-

3,719

$4.760

-

-

-

Vyrian

USA . 2,558 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,558

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,790 parts In-Stock

1+ parts

$4.509

100+ parts

-

1k+ parts

-

10k+ parts

-

2,790

$4.509

-

-

-

AZTECH Wire

Italy . 295 parts In-Stock

1+ parts

$16.540

100+ parts

-

1k+ parts

-

10k+ parts

-

295

$16.540

-

-

-

Parana Technologies

USA . 504 parts In-Stock

1+ parts

$36.363

100+ parts

-

1k+ parts

-

10k+ parts

-

504

$36.363

-

-

-

DigiPath Technology Company

USA . 2,177 parts In-Stock

1+ parts

$40.040

100+ parts

-

1k+ parts

-

10k+ parts

-

2,177

$40.040

-

-

-

ChromeModa Solutions

Germany . 3,715 parts In-Stock

1+ parts

$40.857

100+ parts

$33.503

1k+ parts

-

10k+ parts

-

3,715

$40.857

$33.503

-

-

IDEA Electronic Components Group

UK . 2,213 parts In-Stock

1+ parts

$40.857

100+ parts

$38.814

1k+ parts

$36.771

10k+ parts

-

2,213

$40.857

$38.814

$36.771

-

QUARKTWIN TECHNOLOGY LTD

USA . 21,859 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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21,859

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Overview

Unlock the power of innovation with the MSP430FR5887IPMR by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers cutting-edge technology that exceeds expectations. This versatile microcontroller is perfect for a wide range of applications, offering unparalleled performance and efficiency. Discover the value of seamless connectivity, low power modes, and advanced peripherals that this product brings to the table. Elevate your projects with the MSP430FR5887IPMR and experience next-level quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it suitable for various applications.

Integrated Cache: YES

The presence of an integrated cache helps in improving the performance and efficiency of the microcontroller by reducing access times to frequently used data.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with different voltage sources.

On Chip Data RAM Width: 8

The wide data RAM width of 8 bits enables efficient data processing and storage capabilities within the microcontroller.

Package Shape: SQUARE

The square package shape offers a compact design that can be easily integrated into various electronic systems or PCB layouts.

Bit Size: 16

The 16-bit architecture allows for higher precision and performance compared to 8-bit microcontrollers, making it suitable for more complex applications.

No. of Terminals: 64

The 64 terminals provide ample connectivity options for interfacing with external devices and components, enhancing the versatility of the microcontroller.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in harsh environmental conditions or industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in cold environments without compromising functionality.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to perform analog-to-digital conversion, allowing for interfacing with analog sensors or signals.

DMA Channels: YES

The availability of DMA channels allows for efficient data transfer and processing, reducing the burden on the CPU and improving overall system performance.

ROM Words: 65536

The large ROM capacity of 65536 words provides ample space for program storage and flexibility in firmware development for a wide range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller with various built-in peripherals, it offers rapid and efficient data processing capabilities for embedded systems.

Analog To Digital Convertors: 12-Ch 12-Bit

Having 12 channels of 12-bit ADC allows for precise and accurate analog signal conversion, making it suitable for applications requiring high-resolution measurements.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency of 24 MHz enables fast execution of instructions and high-speed data processing, ideal for time-sensitive applications.

Speed: 16 rpm

The speed of 16 rpm indicates the responsiveness of the microcontroller in processing commands and executing tasks efficiently, crucial for real-time applications.

Technical Specifications

Microcontrollers MSP430FR5887IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR5887IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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