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MSP430FR5870IRGCR

Texas Instruments

MSP430FR5870IRGCR by Texas Instruments

MSP430FR5870IRGCR by Texas Instruments is a 16-bit microcontroller with 8KB RAM and 32KB FRAM ROM. It operates at up to 24MHz, has 8 ADC channels, and features low power mode for industrial applications. With 51 I/O lines, it offers high connectivity through EUSCI(4) and PWM channels for precise control.

Median Price

$2.915

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,490 parts In-Stock

1+ parts

$2.915

100+ parts

$2.376

1k+ parts

$1.584

10k+ parts

-

6,490

$2.915

$2.376

$1.584

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 891 parts In-Stock

1+ parts

$2.769

100+ parts

-

1k+ parts

-

10k+ parts

-

891

$2.769

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-

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Vyrian

USA . 8,741 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,741

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,631 parts In-Stock

1+ parts

$2.624

100+ parts

-

1k+ parts

-

10k+ parts

-

1,631

$2.624

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AZTECH Wire

Italy . 1,040 parts In-Stock

1+ parts

$19.320

100+ parts

-

1k+ parts

-

10k+ parts

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1,040

$19.320

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Parana Technologies

USA . 1,053 parts In-Stock

1+ parts

$75.156

100+ parts

-

1k+ parts

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1,053

$75.156

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DigiPath Technology Company

USA . 1,994 parts In-Stock

1+ parts

$82.756

100+ parts

-

1k+ parts

-

10k+ parts

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1,994

$82.756

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-

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ChromeModa Solutions

Germany . 817 parts In-Stock

1+ parts

$84.445

100+ parts

$69.245

1k+ parts

-

10k+ parts

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817

$84.445

$69.245

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IDEA Electronic Components Group

UK . 529 parts In-Stock

1+ parts

$84.445

100+ parts

$80.223

1k+ parts

$76.000

10k+ parts

-

529

$84.445

$80.223

$76.000

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Overview

The MSP430FR5870IRGCR by Texas Instruments is a game-changer in the world of microcontrollers. With a focus on quality and reliability, Texas Instruments delivers a product that exceeds expectations. This microcontroller is versatile, making it perfect for a wide range of applications. Customers will benefit from its low power consumption, high performance, and innovative features. Say goodbye to compromises with the MSP430FR5870IRGCR - your solution for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product's package.

Maximum Supply Voltage: 3.6 V

Allows the product to operate efficiently within a safe voltage range.

No. of Terminals: 64

Provides ample connection points for various peripherals and external components.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances the product's processing speed and efficiency, making it suitable for a wide range of applications.

Maximum Clock Frequency: 24 MHz

High clock frequency allows for fast operation and responsiveness, making the product suitable for tasks that require quick execution.

Analog To Digital Convertors: 8-Ch 12-Bit

Having multiple ADC channels with 12-bit resolution enables precise analog signal conversion, beneficial for applications requiring accurate data acquisition.

Peripherals: BOR, DMA(3), RTC, TIMER(5), WDT

A variety of built-in peripherals offer enhanced functionality and flexibility for diverse application requirements.

ROM Programmability: FRAM

FRAM technology provides non-volatile memory with fast read/write operations, enhancing the product's performance and reliability.

Technical Specifications

Microcontrollers MSP430FR5870IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

51

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, DMA(3), RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR5870IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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