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MSP430FR5867IRGZT

Texas Instruments

MSP430FR5867IRGZT by Texas Instruments

MSP430FR5867IRGZT by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 32768 ROM words. It features 18-Ch 12-Bit ADC channels, 3 DMA channels, and peripherals like CRC, RTC, and timers. Ideal for industrial applications requiring low power consumption and high-speed processing up to 16 MHz.

Median Price

$4.337

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,540 parts In-Stock

1+ parts

$3.444

100+ parts

$2.808

1k+ parts

$1.872

10k+ parts

-

9,540

$3.444

$2.808

$1.872

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DigiKey

USA . 497 parts In-Stock

1+ parts

$5.230

100+ parts

$3.342

1k+ parts

$3.179

10k+ parts

-

497

$5.230

$3.342

$3.179

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 832 parts In-Stock

1+ parts

$3.272

100+ parts

-

1k+ parts

-

10k+ parts

-

832

$3.272

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Vyrian

USA . 6,329 parts In-Stock

1+ parts

-

100+ parts

-

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6,329

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,156 parts In-Stock

1+ parts

$3.100

100+ parts

-

1k+ parts

-

10k+ parts

-

1,156

$3.100

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-

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Microchip USA

USA . 1,500 parts In-Stock

1+ parts

$22.740

100+ parts

$22.600

1k+ parts

$22.530

10k+ parts

$22.460

1,500

$22.740

$22.600

$22.530

$22.460

Parana Technologies

USA . 1,326 parts In-Stock

1+ parts

$39.702

100+ parts

-

1k+ parts

-

10k+ parts

-

1,326

$39.702

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-

-

Advanced Electronics

New Zealand . 36 parts In-Stock

1+ parts

$42.040

100+ parts

$38.256

1k+ parts

$34.473

10k+ parts

-

36

$42.040

$38.256

$34.473

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DigiPath Technology Company

USA . 556 parts In-Stock

1+ parts

$43.717

100+ parts

-

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-

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556

$43.717

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-

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ChromeModa Solutions

Germany . 6,149 parts In-Stock

1+ parts

$44.609

100+ parts

$36.579

1k+ parts

-

10k+ parts

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6,149

$44.609

$36.579

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IDEA Electronic Components Group

UK . 325 parts In-Stock

1+ parts

$44.609

100+ parts

$42.379

1k+ parts

$40.148

10k+ parts

-

325

$44.609

$42.379

$40.148

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Overview

Enhance your electronic designs with the Texas Instruments MSP430FR5867IRGZT microcontroller, a top-notch product from a trusted manufacturer. This versatile chip offers unmatched performance and reliability, making it ideal for a wide range of applications in various industries. With its low power consumption and advanced features like ADC and DMA channels, this microcontroller provides exceptional value and benefits to customers looking to optimize their projects. Upgrade your devices with the MSP430FR5867IRGZT and experience innovation at its best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material helps in reducing the overall weight of the product and provides good durability.

Surface Mount: YES

Being surface mountable makes it easier to assemble on a circuit board, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

ADC Channels: YES

Having ADC channels allows for analog inputs to be converted to digital signals, enabling the microcontroller to interface with a variety of sensors and devices.

Peripherals: "COMPARATOR, CRC,RTC, TIMER(15), WDT

Multiple peripherals such as comparators, timers, and watchdog timers enhance the functionality and versatility of the microcontroller for different applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

ROM Programmability: FRAM

FRAM technology allows for fast and reliable non-volatile memory storage, ensuring quick access to program data and flexibility in programming options.

Connectivity: "I2C, IRDA, SPI(1), UART, USCI(3)

Multiple connectivity options such as I2C, SPI, and UART enable seamless communication with other devices and systems, enhancing the microcontroller's versatility in networking applications.

Technical Specifications

Microcontrollers MSP430FR5867IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

40

No. of Serial I/Os:

2

No. of Terminals:

48

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(1), UART, USCI(3)"

Peripherals:

"COMPARATOR, CRC,RTC, TIMER(15), WDT"

Analog To Digital Convertors:

18-Ch 12-Bit

Trade Compliance

MSP430FR5867IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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