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MSP430FR5859IRHAR

Texas Instruments

MSP430FR5859IRHAR by Texas Instruments

MSP430FR5859IRHAR by Texas Instruments is a 16-bit microcontroller with 65536 ROM words and 2048 RAM bytes. Featuring 16-Ch 12-Bit ADC, it offers low power mode and operates at up to 16 MHz. Ideal for industrial applications requiring high-speed processing and connectivity via I2C, IRDA, SPI, UART, and USCI interfaces.

Median Price

$3.651

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,614 parts In-Stock

1+ parts

$3.651

100+ parts

$2.976

1k+ parts

$1.984

10k+ parts

-

11,614

$3.651

$2.976

$1.984

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,912 parts In-Stock

1+ parts

$3.468

100+ parts

-

1k+ parts

-

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-

1,912

$3.468

-

-

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Vyrian

USA . 5,689 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

5,689

-

-

-

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

1+ parts

-

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2,500

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,047 parts In-Stock

1+ parts

$3.286

100+ parts

-

1k+ parts

-

10k+ parts

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2,047

$3.286

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-

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AZTECH Wire

Italy . 262 parts In-Stock

1+ parts

$16.070

100+ parts

-

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262

$16.070

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Microchip USA

USA . 5,276 parts In-Stock

1+ parts

$18.054

100+ parts

-

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5,276

$18.054

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Parana Technologies

USA . 1,406 parts In-Stock

1+ parts

$39.140

100+ parts

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1,406

$39.140

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DigiPath Technology Company

USA . 242 parts In-Stock

1+ parts

$43.097

100+ parts

$39.650

1k+ parts

-

10k+ parts

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242

$43.097

$39.650

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ChromeModa Solutions

Germany . 5,952 parts In-Stock

1+ parts

$43.977

100+ parts

$36.061

1k+ parts

-

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5,952

$43.977

$36.061

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IDEA Electronic Components Group

UK . 1,068 parts In-Stock

1+ parts

$43.977

100+ parts

$41.778

1k+ parts

$39.579

10k+ parts

-

1,068

$43.977

$41.778

$39.579

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Lixinc

USA . 11,625 parts In-Stock

1+ parts

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11,625

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Kepictronics

USA . 238 parts In-Stock

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238

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Overview

Discover the cutting-edge MSP430FR5859IRHAR microcontroller by Texas Instruments, a game-changer in the industry. With unmatched quality and reliability, this product offers endless possibilities in various applications. From industrial automation to consumer electronics, this versatile microcontroller delivers exceptional performance and efficiency. Experience the value of Texas Instruments technology with the MSP430FR5859IRHAR and unlock the benefits of innovative features, advanced peripherals, and low power consumption. Trust in Texas Instruments for top-notch solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for packaging microcontrollers as it provides good protection for the component while offering a lightweight and cost-effective solution.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for versatility in power supply options, making this microcontroller suitable for a wide range of applications.

CPU Family: MSP430

The MSP430 family is known for its ultra-low power consumption, making this microcontroller energy-efficient and suitable for battery-powered devices.

ADC Channels: YES

Having Analog to Digital Convertor channels allows for the conversion of real-world signals into digital data, enabling the microcontroller to interact with its environment.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller architecture, this product offers efficient and streamlined processing, ideal for applications requiring high performance.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and allows for high integration density, making this microcontroller efficient and reliable.

Connectivity: I2C, IRDA, SPI(1), UART, USCI(3)

With various connectivity options such as I2C, IRDA, SPI, UART, and USCI, this microcontroller can easily communicate with other devices, expanding its versatility in different applications.

Technical Specifications

Microcontrollers MSP430FR5859IRHAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(1), UART, USCI(3)"

Peripherals:

"COMPARATOR, CRC,RTC, TIMER(15), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR5859IRHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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