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MSP430FR5859IDAR

Texas Instruments

MSP430FR5859IDAR by Texas Instruments

MSP430FR5859IDAR by Texas Instruments is a 16-bit microcontroller with 38 terminals, operating at max 16 MHz. It features 2KB RAM, 65KB ROM, and 16 ADC channels. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$3.511

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,785 parts In-Stock

1+ parts

$3.511

100+ parts

$2.862

1k+ parts

$1.908

10k+ parts

-

10,785

$3.511

$2.862

$1.908

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,630 parts In-Stock

1+ parts

$3.335

100+ parts

-

1k+ parts

-

10k+ parts

-

2,630

$3.335

-

-

-

Vyrian

USA . 3,684 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,684

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,158 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

-

10k+ parts

-

2,158

$3.160

-

-

-

Microchip USA

USA . 1,376 parts In-Stock

1+ parts

$16.660

100+ parts

$16.560

1k+ parts

$16.510

10k+ parts

$16.450

1,376

$16.660

$16.560

$16.510

$16.450

AZTECH Wire

Italy . 950 parts In-Stock

1+ parts

$17.290

100+ parts

-

1k+ parts

-

10k+ parts

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950

$17.290

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-

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Parana Technologies

USA . 889 parts In-Stock

1+ parts

$23.769

100+ parts

-

1k+ parts

$24.398

10k+ parts

-

889

$23.769

-

$24.398

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ChromeModa Solutions

Germany . 6,084 parts In-Stock

1+ parts

$26.707

100+ parts

$21.900

1k+ parts

-

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6,084

$26.707

$21.900

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IDEA Electronic Components Group

UK . 437 parts In-Stock

1+ parts

$26.707

100+ parts

$25.372

1k+ parts

$24.036

10k+ parts

-

437

$26.707

$25.372

$24.036

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DigiPath Technology Company

USA . 1,767 parts In-Stock

1+ parts

-

100+ parts

$24.079

1k+ parts

-

10k+ parts

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1,767

-

$24.079

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR5859IDAR microcontroller. Designed for industrial-grade applications, this versatile device offers unmatched performance and reliability. With a wide range of peripherals including comparators, CRC, RTC, and timers, this microcontroller is perfect for projects requiring precision and efficiency. Experience the seamless connectivity of I2C, IRDA, SPI, UART, and USCI interfaces, providing endless possibilities for your next project. Trust in Texas Instruments' reputation for quality and choose the MSP430FR5859IDAR for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the microcontroller package.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards.

Maximum Supply Voltage: 3.6 V

Can operate at a relatively high supply voltage, providing flexibility in power supply options.

ADC Channels: YES

Analog to digital converter channels allow for accurate analog signal processing.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and speed.

PWM Channels: YES

Pulse width modulation channels enable precise control of digital signals.

Connectivity: "I2C, IRDA, SPI(1), UART, USCI(3)

Multiple connectivity options make it compatible with various communication protocols.

Speed: 16 rpm

Operates at a speed of 16 megahertz, providing speedy processing capabilities.

Low Power Mode: YES

Low power mode conserves energy and prolongs battery life.

Technical Specifications

Microcontrollers MSP430FR5859IDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.2 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(1), UART, USCI(3)"

Peripherals:

"COMPARATOR, CRC,RTC, TIMER(15), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR5859IDAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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