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MSP430FR5859IDA

Texas Instruments

MSP430FR5859IDA by Texas Instruments

MSP430FR5859IDA by Texas Instruments is a 16-bit microcontroller with 38 terminals, featuring 16 MHz clock frequency, 16-Ch ADC, and FRAM ROM. Ideal for industrial applications requiring low power consumption and high-speed processing. Offers various connectivity options like I2C, SPI, UART for versatile integration.

Median Price

$6.202

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,585 parts In-Stock

1+ parts

$4.214

100+ parts

$3.435

1k+ parts

$2.290

10k+ parts

-

9,585

$4.214

$3.435

$2.290

-

Mouser Electronics

USA . 229 parts In-Stock

1+ parts

$8.190

100+ parts

$5.460

1k+ parts

$3.650

10k+ parts

-

229

$8.190

$5.460

$3.650

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,521 parts In-Stock

1+ parts

$4.003

100+ parts

-

1k+ parts

-

10k+ parts

-

2,521

$4.003

-

-

-

Vyrian

USA . 8,321 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,321

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,450 parts In-Stock

1+ parts

$3.580

100+ parts

-

1k+ parts

-

10k+ parts

-

4,450

$3.580

-

-

-

Corphita

USA . 3,089 parts In-Stock

1+ parts

$3.793

100+ parts

-

1k+ parts

-

10k+ parts

-

3,089

$3.793

-

-

-

Parana Technologies

USA . 1,146 parts In-Stock

1+ parts

$24.271

100+ parts

-

1k+ parts

$24.930

10k+ parts

-

1,146

$24.271

-

$24.930

-

IDEA Electronic Components Group

UK . 1,322 parts In-Stock

1+ parts

$27.271

100+ parts

$25.907

1k+ parts

$24.544

10k+ parts

-

1,322

$27.271

$25.907

$24.544

-

ChromeModa Solutions

Germany . 269 parts In-Stock

1+ parts

$27.271

100+ parts

$22.362

1k+ parts

-

10k+ parts

-

269

$27.271

$22.362

-

-

Microchip USA

USA . 2,709 parts In-Stock

1+ parts

$29.320

100+ parts

$29.140

1k+ parts

$29.050

10k+ parts

$28.960

2,709

$29.320

$29.140

$29.050

$28.960

Component Stockers USA

USA . 3,632 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,632

-

-

-

-

DigiPath Technology Company

USA . 286 parts In-Stock

1+ parts

-

100+ parts

$24.588

1k+ parts

-

10k+ parts

-

286

-

$24.588

-

-

Overview

Enhance your electronic designs with the MSP430FR5859IDA by Texas Instruments, a top-tier microcontroller that delivers exceptional performance and reliability. With a wide range of applications in various industries, this product stands out for its quality and innovation. From its advanced features to its low power consumption, the MSP430FR5859IDA offers unmatched value and benefits to customers looking for cutting-edge technology. Trust Texas Instruments for superior products that meet your design needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the microcontroller, making it suitable for various environmental conditions.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, providing flexibility in power supply options for the microcontroller.

No. of Terminals: 38

Having 38 terminals allows for a wide range of connectivity options, making the microcontroller versatile in different applications.

Maximum Clock Frequency: 16 MHz

The high clock frequency allows for fast processing speed, making the microcontroller efficient in executing tasks.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital data, expanding its capability to interact with the external environment.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller ensures efficient and optimized performance for various tasks, enhancing overall system performance.

Analog To Digital Convertors: 16-Ch 12-Bit

Having 16 channels with 12-bit resolution allows the microcontroller to accurately convert analog signals into digital data for precise measurements and control.

Connectivity: "I2C, IRDA, SPI(1), UART, USCI(3)

Support for various communication interfaces such as I2C, SPI, and UART enables seamless connectivity with other devices, enhancing the microcontroller's versatility.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption when the microcontroller is idle, making it energy-efficient and suitable for battery-powered applications.

Speed: 16 rpm

With a speed rating of 16 revolutions per minute, the microcontroller can efficiently handle time-sensitive tasks and applications that require precise timing.

Technical Specifications

Microcontrollers MSP430FR5859IDA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.2 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(1), UART, USCI(3)"

Peripherals:

"COMPARATOR, CRC,RTC, TIMER(15), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR5859IDA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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