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MSP430FR5848IDAR

Texas Instruments

MSP430FR5848IDAR by Texas Instruments

MSP430FR5848IDAR by Texas Instruments is a 16-bit microcontroller with 49152 ROM words and 2048 RAM bytes. It features 16-Ch 12-Bit ADC channels, 15 timers, and low power mode suitable for industrial applications. With I2C, IRDA, SPI(1), UART connectivity options and FRAM programmability, it offers versatile solutions in a compact form factor.

Median Price

$3.400

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,726 parts In-Stock

1+ parts

$3.400

100+ parts

$2.772

1k+ parts

$1.848

10k+ parts

-

13,726

$3.400

$2.772

$1.848

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,268 parts In-Stock

1+ parts

$3.230

100+ parts

-

1k+ parts

-

10k+ parts

-

2,268

$3.230

-

-

-

Vyrian

USA . 3,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,075

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,686 parts In-Stock

1+ parts

$3.060

100+ parts

-

1k+ parts

-

10k+ parts

-

2,686

$3.060

-

-

-

AZTECH Wire

Italy . 1,092 parts In-Stock

1+ parts

$14.650

100+ parts

-

1k+ parts

-

10k+ parts

-

1,092

$14.650

-

-

-

Microchip USA

USA . 1,649 parts In-Stock

1+ parts

$16.140

100+ parts

$16.040

1k+ parts

$15.990

10k+ parts

$15.940

1,649

$16.140

$16.040

$15.990

$15.940

Component Stockers USA

USA . 3,066 parts In-Stock

1+ parts

$38.550

100+ parts

-

1k+ parts

-

10k+ parts

-

3,066

$38.550

-

-

-

Parana Technologies

USA . 1,496 parts In-Stock

1+ parts

$49.728

100+ parts

-

1k+ parts

-

10k+ parts

-

1,496

$49.728

-

-

-

DigiPath Technology Company

USA . 1,626 parts In-Stock

1+ parts

$54.757

100+ parts

$50.376

1k+ parts

-

10k+ parts

-

1,626

$54.757

$50.376

-

-

IDEA Electronic Components Group

UK . 2,257 parts In-Stock

1+ parts

$55.874

100+ parts

$53.080

1k+ parts

$50.287

10k+ parts

-

2,257

$55.874

$53.080

$50.287

-

ChromeModa Solutions

Germany . 1,700 parts In-Stock

1+ parts

$55.874

100+ parts

$45.817

1k+ parts

-

10k+ parts

-

1,700

$55.874

$45.817

-

-

Overview

Unlock the full potential of your electronic projects with the MSP430FR5848IDAR by Texas Instruments, a top-tier microcontroller designed to deliver unparalleled performance and reliability. With a wide range of applications in various industries, this cutting-edge device boasts advanced features like low power mode, FRAM programmability, and a plethora of peripherals including comparators and timers. Experience seamless connectivity with I2C, IRDA, SPI, UART, and USCI interfaces, while enjoying the benefits of high-speed processing and efficient power management. Trust in Texas Instruments' legacy of excellence and innovation to take your projects to the next level with the MSP430FR5848IDAR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of applications.

Bit Size: 16

Higher bit size allows for more complex operations and calculations, making it suitable for advanced applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture allows for efficient and streamlined processing, enhancing overall performance of the microcontroller.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to interface with analog sensors and signals, expanding its range of applications.

PWM Channels: YES

PWM channels allow for precise control of analog devices, making the microcontroller suitable for applications requiring precise modulation.

Connectivity: I2C, IRDA, SPI(1), UART, USCI(3)

Multiple connectivity options provide flexibility in communication protocols, making it compatible with a variety of peripheral devices.

Low Power Mode: YES

The low power mode helps in conserving energy, making the microcontroller suitable for battery-powered devices or applications where power efficiency is essential.

Technical Specifications

Microcontrollers MSP430FR5848IDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

49152

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.2 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(1), UART, USCI(3)"

Peripherals:

"COMPARATOR, CRC,RTC, TIMER(15), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR5848IDAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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