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MSP430FR5847IDAR

Texas Instruments

MSP430FR5847IDAR by Texas Instruments

MSP430FR5847IDAR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 32768 ROM words. It features 16 ADC channels, 3 DMA channels, and peripherals like CRC, RTC, and timers. Ideal for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SPI, UART, and USCI interfaces at a max clock frequency of 16 MHz.

Median Price

$2.782

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 34,239 parts In-Stock

1+ parts

$2.782

100+ parts

$2.268

1k+ parts

$1.512

10k+ parts

-

34,239

$2.782

$2.268

$1.512

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 850 parts In-Stock

1+ parts

$2.643

100+ parts

-

1k+ parts

-

10k+ parts

-

850

$2.643

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-

-

Vyrian

USA . 2,482 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,482

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 153 parts In-Stock

1+ parts

$2.504

100+ parts

-

1k+ parts

-

10k+ parts

-

153

$2.504

-

-

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AZTECH Wire

Italy . 339 parts In-Stock

1+ parts

$20.690

100+ parts

-

1k+ parts

-

10k+ parts

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339

$20.690

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-

-

Parana Technologies

USA . 2,316 parts In-Stock

1+ parts

$62.425

100+ parts

-

1k+ parts

-

10k+ parts

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2,316

$62.425

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-

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DigiPath Technology Company

USA . 1,308 parts In-Stock

1+ parts

$68.738

100+ parts

-

1k+ parts

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10k+ parts

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1,308

$68.738

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-

-

IDEA Electronic Components Group

UK . 2,210 parts In-Stock

1+ parts

$70.141

100+ parts

$66.634

1k+ parts

$63.127

10k+ parts

-

2,210

$70.141

$66.634

$63.127

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ChromeModa Solutions

Germany . 713 parts In-Stock

1+ parts

$70.141

100+ parts

$57.516

1k+ parts

-

10k+ parts

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713

$70.141

$57.516

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Overview

Unlock new possibilities with the Texas Instruments MSP430FR5847IDAR microcontroller, delivering high-quality performance and reliability. Designed for a wide range of applications, this versatile device offers unparalleled value with its advanced features and low power consumption. Experience seamless connectivity and efficient operation with this innovative product, setting new standards in the industry. Trust Texas Instruments to provide cutting-edge technology that empowers you to achieve more.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is cost-effective and provides good insulation for the microcontroller, making it a durable choice for various applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for versatility in power supply options and can accommodate a wider range of input voltages.

No. of Timers: 15

Having 15 timers allows for precise timing control in different functions and applications, enhancing the versatility of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient and fast processing of instructions, making the microcontroller suitable for high-performance applications.

ADC Channels: YES

Having ADC channels enables the microcontroller to efficiently convert analog signals to digital, allowing for accurate data acquisition and processing.

DMA Channels: YES

Support for DMA channels improves data transfer efficiency by allowing direct memory access without involving the CPU, enhancing overall system performance.

Peripherals: 'COMPARATOR, CRC,RTC, TIMER(15), WDT'

A wide range of peripherals such as comparators, CRC, real-time clock, timers, and watchdog timer enhance the functionality and versatility of the microcontroller for various applications.

ROM Programmability: FRAM

Using FRAM technology for ROM programmability provides fast and reliable non-volatile memory storage, enhancing the overall performance and reliability of the microcontroller.

Connectivity: 'I2C, IRDA, SPI(1), UART, USCI(3)'

Support for multiple connectivity options like I2C, IRDA, SPI, UART, and USCI allows for easy integration with external devices and communication protocols, expanding the capabilities of the microcontroller.

Low Power Mode: YES

Low power mode functionality helps in reducing power consumption during idle or low activity periods, making the microcontroller energy-efficient and suitable for battery-powered applications.

Technical Specifications

Microcontrollers MSP430FR5847IDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.2 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(1), UART, USCI(3)"

Peripherals:

"COMPARATOR, CRC,RTC, TIMER(15), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR5847IDAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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