Loading...

MSP430FR5739CY

Texas Instruments

MSP430FR5739CY by Texas Instruments

MSP430FR5739CY by Texas Instruments is a 16-bit microcontroller with max clock freq of 24 MHz. It operates in industrial temp range (-40 to 85 °C) and supports ADC, DMA, PWM channels. Ideal for applications requiring high-speed processing and precise analog-to-digital conversion in harsh environments.

Median Price

$2.379

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.379

10k+ parts

-

780

-

-

$2.379

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,534 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,534

-

-

-

-

Digiode

USA . 914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

914

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 454 parts In-Stock

1+ parts

$1.760

100+ parts

-

1k+ parts

-

10k+ parts

-

454

$1.760

-

-

-

Microchip USA

USA . 1,756 parts In-Stock

1+ parts

$16.541

100+ parts

-

1k+ parts

-

10k+ parts

-

1,756

$16.541

-

-

-

Parana Technologies

USA . 1,462 parts In-Stock

1+ parts

$59.695

100+ parts

-

1k+ parts

-

10k+ parts

-

1,462

$59.695

-

-

-

ChromeModa Solutions

Germany . 6,753 parts In-Stock

1+ parts

$67.073

100+ parts

$55.000

1k+ parts

-

10k+ parts

-

6,753

$67.073

$55.000

-

-

IDEA Electronic Components Group

UK . 661 parts In-Stock

1+ parts

$67.073

100+ parts

$63.719

1k+ parts

$60.366

10k+ parts

-

661

$67.073

$63.719

$60.366

-

Corphita

USA . 3,931 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,931

-

-

-

-

DigiPath Technology Company

USA . 867 parts In-Stock

1+ parts

-

100+ parts

$60.473

1k+ parts

-

10k+ parts

-

867

-

$60.473

-

-

Overview

Experience the power of innovation with the MSP430FR5739CY by Texas Instruments. This cutting-edge microcontroller offers unmatched quality and reliability, making it the top choice for a wide range of applications. With advanced features like ADC and DMA channels, PWM capabilities, and a maximum clock frequency of 24 MHz, this device delivers exceptional performance. Whether you're designing industrial equipment or consumer electronics, the MSP430FR5739CY provides the value, flexibility, and efficiency you need to bring your ideas to life. Trust Texas Instruments to deliver the best in microcontroller technology.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and reliable soldering onto a PCB, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of applications without the risk of damaging the microcontroller due to overvoltage.

Bit Size: 16

Provides ample computational power for handling complex tasks efficiently.

Package Style (Meter): UNCASED CHIP

Allows for compact design and integration into various electronic devices.

Minimum Supply Voltage: 2 V

Enables operation in low power scenarios, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high temperature environments.

Minimum Operating Temperature: -40 °C

Maintains functionality in extreme cold conditions, making it suitable for a wide range of environments.

ADC Channels: YES

Allows for analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

DMA Channels: YES

Enables efficient data transfer between peripherals without CPU intervention, improving overall system performance.

Terminal Position: UPPER

Facilitates easier PCB layout and routing, enhancing overall design simplicity.

Maximum Clock Frequency: 24 MHz

Provides high processing speed, allowing for quick execution of instructions.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient instruction execution and reduced power consumption.

Technology: CMOS

Offers low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: NO LEAD

Allows for direct mounting on PCBs without the need for traditional leaded components, streamlining assembly.

Nominal Supply Voltage: 3 V

Optimal supply voltage for stable operation and performance.

PWM Channels: YES

Supports Pulse Width Modulation output for precise control over devices such as motors and LEDs.

Speed: 24 rpm

Indicates the maximum rotational speed supported for connected motors, suitable for a variety of applications.

Technical Specifications

Microcontrollers MSP430FR5739CY attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

X-XUUC-N

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

24 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

MSP430FR5739CY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20